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processes. There are many factors to consider in selection of either electrolytic or electroless plating methods. These include what the deposit will be used for, configuration of the part, materials compatibility and cost of processing. In different applications, electrolytic or electroless plating
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layer is used to counter this effect; these can be nickel or rhodium. Copper, which also migrates into gold, does so more slowly than silver. The copper is usually further plated with nickel. A gold-plated silver article is usually a silver substrate with layers of copper, nickel, and gold deposited
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may cause higher losses due to higher electrical resistance of nickel; a nickel-plated trace can have its useful length shortened three times in the 1 GHz band in comparison with the non-plated one. Selective plating is used, depositing the nickel and gold layers only on areas where it is
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If the gold layer does not completely dissolve into the solder, then slow intermetallic reactions can proceed in the solid state as the tin and gold atoms cross-migrate. Intermetallics have poor electrical conductivity and low strength. The ongoing intermetallic reactions also cause
369:. The thickness of gold plating on jewellery is noted in microns (or micro-meters). The microns of thickness determines how long the gold plating lasts with usage. The jewellery industry denotes different qualities of gold plating in the following terminology
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Gold, applied by evaporated methods or electroplating, has been specified by NASA to thermally control spacecraft instruments, due to its 99.4% reflectivity in infrared wavelengths.
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Wire bonding between gold plated contacts and aluminium wires or between aluminium contacts and gold wires under certain conditions develops a brittle layer of
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Gold plated silver jewellery can still tarnish as the silver atoms diffuse into the gold layer, causing slow gradual fading of its color and eventually causing
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63% tin – 37% lead solder is used, no lead-gold compounds are formed, because gold preferentially reacts with tin, forming the
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is the decorative covering of an object with gold, which typically involve more traditional methods and much larger objects.
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layer before applying the gold layer; improper cleaning leads to a nickel surface difficult to solder. A stronger
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planes, significantly lowering the mechanical strength and therefore reliability of the resulting solder joints.
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of the surface. This process may take months and even years, depending on the thickness of the gold layer. A
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is deposited using lower concentration of gold in the baths. Usually contains nickel and/or cobalt as well.
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can be plated. This technology can be used for depositing layers suitable for wire bonding.
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Heavy gold plated / Vermeil - gold layer thickness greater than or equal to 2.5 micron
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A 2–3 μm layer of gold dissolves completely within one second during typical
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ranges between 60 and 85. The plating baths have to be kept free of contamination.
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Non-cyanide, generally sulphite or chloride-based for gold and gold alloy plating
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contains phosphorus. Nickel with more than 8% phosphorus is not solderable.
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are often made by controlled-depth immersion of only the edge of the boards.
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resistance. It also reduces the impact of pores present in the gold layer.
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There are several types of gold plating used in the electronics industry:
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Gold plated - gold layer thickness greater than or equal to 0.5 micron
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Gold flashed / Gold washed - gold layer thickness less than 0.5 micron
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may be in need of reorganization to comply with
Knowledge (XXG)'s
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refers to modern coating methods, such as the ones used in the
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Acid gold plating for bright hard gold and gold alloy plating
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There are five recognized classes of gold plating chemistry:
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gold-plated parts can be problematic as gold is soluble in
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is another nickel contaminant that hinders solderability.
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conditions. Layers of gold thinner than 0.5 μm (0.02
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required and does not cause the detrimental side effects.
703:- inventor who was first to do gold plating as a business
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Gold plating is often used in electronics, to provide a
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Gold plating of silver is used in the manufacture of
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can help, as it aids dissolving the oxide deposits.
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disperse in the solder matrix, forming preferential
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469:Both the nickel and gold layers can be plated by
439:tend to diffuse through the gold layer, causing
435:With direct gold-on-copper plating, the copper
300:onto the surface of another metal, most often
198:Please help improve this article, possibly by
104:to make improvements to the overall structure.
347:Neutral gold cyanide, for high-purity plating
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420:-resistant electrically conductive layer on
489:Gold plating may lead to formation of gold
71:Learn how and when to remove these messages
27:Coating an object with a thin layer of gold
296:is a method of depositing a thin layer of
679:. An acid bath is required to remove the
233:Learn how and when to remove this message
120:Learn how and when to remove this message
523:. The gold layer is easily soldered and
253:space craft that protects a gold-plated
162:of all important aspects of the article.
750:"Nickel-gold plating copper PCB traces"
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608:in their liquid state, forming brittle
158:Please consider expanding the lead to
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202:the article and/or by introducing a
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586:Gold-plated printed circuit board
412:Gold-plated electrical connectors
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782:from the original on 2017-04-11
778:. Products Finishing Magazine.
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249:Gold-plated aluminium cover on
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60:or discuss these issues on the
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726:"Gold Coating | NASA Spinoff"
498:gold-aluminium intermetallics
32:Gold plating (disambiguation)
774:Weisberg, Alfred M. (1997).
549:Bright hard gold on contacts
752:. Polar Instruments. 2003.
481:At higher frequencies, the
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669:Electroless nickel plating
537:is deposited from special
478:can have cost advantages.
284:National Automobile Museum
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834:Electronics manufacturing
628:compound. Particles of
517:Soft, pure gold plating
600:Gold reacts with both
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543:printed circuit boards
521:semiconductor industry
454:A layer of a suitable
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30:For other uses, see
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54:Please help
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681:passivation
525:wire bonded
500:, known as
483:skin effect
475:electroless
404:Electronics
316:) process.
310:silver-gilt
828:Categories
786:2013-04-03
760:2007-03-28
735:2024-04-22
713:References
458:, usually
441:tarnishing
385:tarnishing
324:, whereas
57:improve it
18:Gold plate
844:Jewellery
591:Soldering
541:. Entire
418:corrosion
367:jewellery
361:Jewellery
308:(to make
208:talk page
200:splitting
152:summarize
63:talk page
839:Coatings
794:Archived
780:Archived
754:Archived
695:See also
642:cleavage
614:eutectic
491:whiskers
449:sulphide
612:. When
555:and/or
451:layer.
447:and/or
342:cyanide
326:gilding
318:Plating
251:Voyager
689:Carbon
595:solder
557:cobalt
553:nickel
527:. Its
460:nickel
422:copper
306:silver
302:copper
258:record
508:Types
445:oxide
437:atoms
685:flux
665:thou
630:AuSn
618:AuSn
606:lead
604:and
567:tabs
464:wear
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298:gold
602:tin
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