38:
318:, is an operating mode of later generations of Intel mobile processors (as of January 2014) and AMD processors (as of June 2012) that allows adjustments in their TDP values. By modifying the processor behavior and its performance levels, power consumption of a processor can be changed altering its TDP at the same time. That way, a processor can operate at higher or lower performance levels, depending on the available cooling capacities and desired power consumption.
247:
a fraction of said TDP, and very probably more than processors with lower TDP from the same manufacturer, but it may or may not use more power than a processor from a different manufacturer with a not excessively lower TDP, such as 90 W). Additionally, TDPs are often specified for families of processors, with the low-end models usually using significantly less power than those at the high end of the family.
400:
262:
family of processors. Intel calculates a specified chip's TDP according to the amount of power the computer's fan and heatsink need to be able to dissipate while the chip is under sustained load. Actual power usage can be higher or (much) lower than TDP, but the figure is intended to give guidance to
211:
The TDP of a CPU has been underestimated in some cases, leading to certain real applications (typically strenuous, such as video encoding or games) causing the CPU to exceed its specified TDP and resulting in overloading the computer's cooling system. In this case, CPUs either cause a system failure
246:
Since safety margins and the definition of what constitutes a real application vary among manufacturers, TDP values between different manufacturers cannot be accurately compared (a processor with a TDP of, for example, 100 W will almost certainly use more power at full load than processors with
279:
TDP specifications for some processors may allow them to work under multiple different power levels, depending on the usage scenario, available cooling capacities and desired power consumption. Technologies that provide such variable TDPs include
374:: "SDP is an additional thermal reference point meant to represent thermally relevant device usage in real-world environmental scenarios. It balances performance and power requirements across system workloads to represent real-world power usage."
184:
processors). Intel's thermal design power (TDP), used for
Pentium and Core 2 processors, measures the energy consumption under high workload; it is numerically somewhat higher than the "average" ACP rating of the same processor.
212:(a "therm-trip") or throttle their speed down. Most modern processors will cause a therm-trip only upon a catastrophic cooling failure, such as a no longer operational fan or an incorrectly mounted heat sink.
384:) is not an additional power state of a processor. The SDP only states the average power consumption of a processor using a certain mix of benchmark programs to simulate "real-world" scenarios". For example,
890:
708:
484:
334: – when a cooler or quieter mode of operation is desired, this mode specifies a lower TDP and lower guaranteed frequency versus the nominal mode.
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204:
and server-intensive workload environments. AMD said that the ACP and TDP values of the processors will both be stated and do not replace one another.
605:
413:
464:
340: – when extra cooling is available, this mode specifies a higher TDP and higher guaranteed frequency versus the nominal mode.
227:
for the laptop's CPU. A cooling system can do this using an active cooling method (e.g. conduction coupled with forced convection) such as a
41:
Heatsink mounted on a motherboard, cooling the CPU underneath it. This heatsink is designed with the cooling capacity matching the CPU’s TDP.
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engineers designing cooling solutions for their products. In particular, Intel's measurement also does not fully take into account
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96:
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200:
and STREAM Benchmark (memory bandwidth), which AMD said is an appropriate method of power consumption measurement for
385:
345:
527:
737:
644:
364:
891:"4th Generation Intel Core processor based on Mobile U-Processor and Y-Processor Lines Datasheet, Volume 1 of 2"
709:"4th Generation Intel Core processor based on Mobile M-Processor and H-Processor Lines Datasheet, Volume 1 of 2"
592:
259:
165:
952:
771:
188:
According to AMD the ACP rating includes the power consumption when running several benchmarks, including
173:
418:
108:
485:"Intel Brings Core Down to 7W, Introduces a New Power Rating to Get There: Y-Series SKUs Demystified"
224:
30:
This article is about the thermal design envelope of microprocessors. For the general concept, see
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405:
223:
TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum
460:
428:
264:
240:
236:
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70:
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processors support cTDP up, cTDP down, or both modes. As another example, some of the AMD
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169:
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388:(extreme-low power) mobile Haswell processor show the difference between TDP and SDP.
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764:
37:
423:
232:
85:
31:
17:
620:"Testing Thermal Throttling in Pentium 4 CPUs with Northwood and Prescott cores"
363:
processor implements a similar power capping functionality through its embedded
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328: – this is the processor's rated frequency and TDP.
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Intel processors that support cTDP provide three operating modes:
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used to report the maximum power draw of its processors as TDP.
220:
197:
193:
58:
922:
Details on AMD Bulldozer: Opterons to
Feature Configurable TDP
293:
251:
66:
62:
870:"The technical details behind Intel's 7 Watt Ivy Bridge CPUs"
666:"The technical details behind Intel's 7 Watt Ivy Bridge CPUs"
846:"Intel Core i7-4610Y Processor (4M Cache, up to 2.90 GHz)"
88:
for a microprocessor is usually 1.5 times the TDP rating.
765:"AMD Opteron 4200 Series Processor Quick Reference Guide"
688:"Who REALLY Runs Hotter? AMD (3800X) vs Intel (i9-9900K)"
27:
Amount of heat a computer's cooling system must dissipate
547:"Memory bandwidth: Stream benchmark performance results"
208:
and later server processors have the two power figures.
583:
Huynh, Anh T.; Kubicki, Kristopher (7 September 2007).
267:
due to the default time limits, while AMD does because
172:
processors, under "average" daily usage as defined by
928:, July 15, 2011, by Johan De Gelas and Kristian Vättö
243:. Typically, a combination of these methods is used.
176:(AMD) for use in its line of processors based on the
645:"Who to believe on power consumption? AMD or Intel?"
566:"AMD's Quad-Core Barcelona: Defending New Territory"
219:'s CPU cooling system may be designed for a 20
759:
757:
258:changed this practice with the introduction of its
61:generated by a computer chip or component (often a
738:"Testing Out The Configurable TDP On AMD's Kaveri"
507:"Intel responds to cooked power efficiency claims"
703:
701:
478:
476:
359:can be configured for lower TDP values. IBM's
456:Computer Architecture: A Quantitative Approach
453:John L. Hennessy; David A. Patterson (2012).
235:, or any of the two passive cooling methods:
8:
271:always tries to push for the maximum power.
112:
606:DailyTech - Introducing Average CPU Power
91:Intel has introduced a new metric called
445:
819:"OCC Firmware Code is Now Open Source"
585:"AMD Unveils "Barcelona" Architecture"
459:(5th ed.). Elsevier. p. 22.
414:Heat generation in integrated circuits
840:
838:
564:de Gelas, Johan (10 September 2007).
7:
618:Stanislav Garmatyuk (2004-03-26).
164:(ACP) is the power consumption of
25:
84:Some sources state that the peak
934:, April 15, 2001, by Paul DeMone
686:Linus Tech Tips (Sep 16, 2019).
398:
505:Crothers, Brooke (2013-01-09).
483:Anand Lal Shimpi (2013-01-14).
736:Michael Larabel (2014-01-22).
1:
668:. arstechnica.com. 2013-01-14
77:in a computer is designed to
817:Todd Rosedahl (2014-12-20).
528:"Istanbul EE launches today"
182:Opteron 8300 and 2300 series
372:scenario design power (SDP)
57:, is the maximum amount of
969:
872:. Ars Technica. 2013-01-14
106:
29:
793:"Sony Vaio Duo 13 Review"
643:Ou, George (2006-07-17).
344:For example, some of the
166:central processing units
823:openpowerfoundation.org
370:Intel's description of
772:Advanced Micro Devices
174:Advanced Micro Devices
42:
419:Operating temperature
378:Scenario design power
290:scenario design power
109:CPU power dissipation
99:Y-series processors.
93:scenario design power
40:
948:Computer engineering
797:mobiletechreview.com
225:junction temperature
114:ACP compared to TDP
81:under any workload.
55:thermal design point
53:), sometimes called
47:thermal design power
932:Making x86 Run Cool
595:on 27 October 2007.
180:microarchitecture (
115:
533:2011-07-28 at the
406:Electronics portal
365:on-chip controller
250:Until around 2006
113:
43:
18:Thermal throttling
466:978-0-12-383872-8
429:Intel Turbo Boost
310:), also known as
265:Intel Turbo Boost
237:thermal radiation
162:average CPU power
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16:(Redirected from
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591:. Archived from
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304:Configurable TDP
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71:system on a chip
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718:. December 2013
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535:Wayback Machine
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352:processors and
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215:For example, a
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95:(SDP) for some
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916:External links
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346:mobile Haswell
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902:. Retrieved
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826:. Retrieved
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801:. Retrieved
799:. 2013-07-22
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776:. Retrieved
745:. Retrieved
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720:. Retrieved
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670:. Retrieved
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649:. Retrieved
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627:. Retrieved
624:ixbtlabs.com
623:
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593:the original
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551:virginia.edu
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511:. Retrieved
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489:. Retrieved
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424:Power rating
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275:Alternatives
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202:data centers
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92:
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86:power rating
83:
54:
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32:power rating
774:. June 2012
326:Nominal TDP
292:(SDP), and
288:(cTDP) and
198:SPECjbb2005
194:SPECcpu2006
154:137 W
146:115 W
103:Calculation
73:) that the
942:Categories
904:2013-12-22
876:2013-12-22
855:2014-02-11
828:2014-12-27
803:2014-02-11
778:2014-08-31
747:2014-08-31
722:2013-12-22
672:2013-01-14
651:2014-02-11
629:2013-12-21
513:2014-02-11
491:2014-02-11
440:References
241:conduction
151:105 W
138:79 W
130:60 W
107:See also:
97:Ivy Bridge
926:AnandTech
589:DailyTech
570:AnandTech
332:cTDP down
229:heat sink
206:Barcelona
143:75 W
135:55 W
127:40 W
79:dissipate
742:Phoronix
531:Archived
392:See also
386:Y-series
692:YouTube
647:. ZDNet
367:(OCC).
350:Opteron
338:cTDP up
231:with a
463:
361:POWER8
354:Kaveri
260:Conroe
217:laptop
170:server
898:Intel
894:(PDF)
850:Intel
768:(PDF)
716:Intel
712:(PDF)
282:Intel
256:Intel
190:TPC-C
461:ISBN
357:APUs
308:cTDP
160:The
122:TDP
119:ACP
59:heat
45:The
382:SDP
314:or
296:'s
294:AMD
284:'s
252:AMD
239:or
233:fan
178:K10
69:or
67:GPU
63:CPU
51:TDP
944::
924:,
896:.
848:.
837:^
821:.
795:.
770:.
756:^
740:.
714:.
700:^
690:.
622:.
587:.
568:.
549:.
475:^
300:.
196:,
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65:,
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879:.
858:.
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781:.
750:.
725:.
694:.
675:.
654:.
632:.
572:.
553:.
516:.
494:.
469:.
380:(
306:(
221:W
49:(
34:.
20:)
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