93:
well-defined functional modules interconnected by a network. The key assumptions were thus that the networking paradigm gave modules well-structured, layered interfaces and that it was time to improve the system architecture of mobile systems to make their hardware- and software design more modular. In other words, the goals were to counteract the rising development costs, development risks and time-to-market impact of increasingly complex system integration.
64:
such a networked environment, pairs of UniPro devices are interconnected via so-called links while data packets are routed toward their destination by UniPro switches. These switches are analogous to the routers used in wired LAN based on gigabit
Ethernet. But unlike a LAN, the UniPro technology was designed to connect chips within a mobile terminal, rather than to connect computers within a building.
76:
68:
323:
physical layer, the M-PHY. Furthermore, UniPort-M features local and remote control of a peer UniPro device that can be used for example to control various supported power modes of the link. Planned roadmap steps beyond UniPro v1.4x aim to provide specifications for network-capable endpoint and network switch devices.
259:
PIE: Processor
Emulation Interface. This application protocol conveys traditional memory-based read/write transactions as found on processor busses. Data streaming applications (e.g. multimedia traffic), command/response-type protocols (e.g. for control), and tunneling of popular protocols from other
63:
UniPro version 1.6 concentrates on enabling high-speed point to point communication between chips in mobile electronics. UniPro has provisions for supporting networks consisting of up to 128 UniPro devices (integrated circuit, modules, etc.). Network features are planned in future UniPro releases. In
722:
Similar architectures have emerged in other domains (e.g. automotive networks, largely standardized PC architectures, IT industry around the
Internet protocols) for similar reasons of interoperability and economy of scale. It is nevertheless too early to predict how rapidly UniPro will be adopted by
694:
The UniPro specification itself covers Layers 1.5, 2, 3, 4 and the DME (Device
Management Entity). The Application Layer (LA) is out of scope because different uses of UniPro will require different LA protocols. The Physical Layer (L1) is covered in separate MIPI specifications in order to allow the
353:
Note that such applications require an application protocol layer on top of UniPro to define the structure and semantics of the byte streams transported by UniPro. These can be done by simply porting existing data formats (e.g. tracing, pixel streams, IP packets), introducing new proprietary formats
714:
UniPro is specifically targeted by MIPI to simplify the creation of increasingly complex products. This implies a relatively long-term vision about future handset architectures composed of modular subsystems interconnected via stable, standardized, but flexible network interfaces. It also implies a
135:
To date, several vendors have announced the availability of UniPro IP blocks and various chip suppliers have created implementations that are at various phases of development. In the meantime, the MIPI UniPro
Working Group is setting up a conformance test suite and is preparing future extensions of
123:
The final draft of
Version 1.6 of the UniPro specification was completed in August 2013. Its acknowledgements list 19 engineers from 12 companies and organizations: Agilent, Cadence, IEEE-ISTO, Intel, nVidia, Nokia, Qualcomm, Samsung, STMicroelectronics, Synopsys, Texas Instruments and Toshiba. The
751:
interfaces). This is for example because of the silicon area occupied by the required mixed-signal circuitry (Layer 1), as well as due to the complexity and buffer space required to automatically correct bit errors. UniPro's cost and complexity may thus be an issue for certain low bandwidth UniPro
335:
UniPro and its underlying physical layer were designed to support low power operation needed for battery-operated systems. These features range from power-efficient high-speed operation to added low-power modes during idle or low bandwidth periods on the network. Actual power behavior is, however,
322:
The architects designing UniPro intended from the start to release the technology as a step-wise roadmap with backward compatibility. UniPro 1.1 is designed to be fully backwards compatible with UniPro 1.0. The main purpose of UniPro 1.40 and UniPro v1.41 (UniPro v1.4x) is to support an additional
119:
In
January 2011, UniPro Version 1.40 was completed. Its main purpose is full support for a new Physical Layer: M-PHY including support for power modes change and peer device configuration. In July 2012 UniPro v1.40 has been upgraded to UniPro v1.41 to support the newer higher speed M-PHY v2.0. The
760:
As
Metcalfe postulated, the value of a network technology scales with the square of the number of devices which use that technology. This makes any new cross-vendor interconnect technology only as valuable as the commitment of its proponents and the resulting likelihood that the technology will
785:
Interoperability requires more than just alignment between the peer UniPro devices on protocol layer L1–L4: it also means aligning on more application-specific data formats, commands and their meaning, and other protocol elements. This is a known intrinsically unsolvable problem in all design
92:
The initiative to develop the UniPro protocol came forth out of a pair of research projects at respectively Nokia
Research Center and Philips Research. Both teams independently arrived at the conclusion that the complexity of mobile systems could be reduced by splitting the system design into
306:
is used to represent the actual port on a chip which conforms to the UniPro specification for its upper layers (L1.5 to 4) and a MIPI PHY specification for L1. As there are two PHY technologies, these are respectively known as UniPort-D (UniPro with D-PHY) and UniPort-M (UniPro with M-PHY).
577:
The UniPro protocol stack follows the classical OSI reference architecture (ref). For practical reasons, OSI's
Physical Layer is split into two sub-layers: Layer 1 (the actual physical layer) and Layer 1.5 (the PHY Adapter layer) which abstracts from differences between alternative Layer 1
786:
methodologies: you can agree on standard and reusable "plumbing" (lower hardware/software/network layers), but that doesn't automatically get you alignment on the detailed semantics of even a trivial command like ChangeVolume(value) or the format of a media stream.
826:
The Membership Agreement of the MIPI Alliance specifies the licensing conditions for MIPI specifications for member companies. Royalty-free licensing conditions apply within the main target domain of the MIPI Alliance, mobile phones and their peripherals, whereas
773:, in-vehicle networks), adoption rate is presumed to be main concern about the technology. This is especially true because the mobile industry has virtually no track record on hardware standards which pertain to the internals of the product.
143:
On January 30, 2018, JEDEC published the UFS 3.0 standard which uses MIPI M-PHY v4.1 (with HS-Gear4) and MIPI UniPro v1.8 for mobile memory with data rates up to 2900 MB/s (11,6 Gbit/s per lane, 2 lanes, 23,2 Gbit/s total).
326:
The UniPro v1.6 Specification was designed to ensure interoperability with UniPro v1.41.00 when using the M-PHY physical layer. As D-PHY is no longer supported on v1.60, backwards compatibility for D-PHY operation cannot be maintained.
124:
UniPro v1.6 Specification is an update to the UniPro v1.41.00 Specification, and consists solely of the UniPro specification document, SDL is no longer supported. The UniPro v1.6 Specification references the following documents:
51:
aim to provide high-speed data communication (gigabits/second), low-power operation (low swing signaling, standby modes), low pin count (serial signaling, multiplexing), small silicon area (small packet sizes), data reliability
776:
A key driver for UniPro adoption is JEDEC Universal Flash Storage (UFS) v2.0 which uses MIPI UniPro and M-PHY as the basis for the standard. There are several implementation of the standard which are expected to hit the market
100:'s UniPro Working Group. Such multi-company collaboration was considered essential to achieve interoperability between components from different component vendors and to achieve the necessary scale to drive the new technology.
243:. Next generation mass storage devices specified by JEDEC with a support for data throughput of up to 300 MB/sec, in the first generation, and support command queuing features to raise the random read/write speed.
103:
The name of both the working group and the standard, UniPro, reflects the need to support a wide range of modules and wide range of data traffic using a single protocol stack. Although other connectivity technologies
116:) exist which also support a wide range of applications, the inter-chip interfaces used in mobile electronics are still diverse which differs significantly from the (in this respect more mature) computer industry.
810:
Use application-specific software drivers. This only works for limited data rates and pushes the interoperability problem into an internal software interoperability problem, but is a well understood approach.
519:
Upgrade to support M-PHY v3.0 with HS-Gear3, Power Reduction during M-PHY Sleep and Stall States, Scrambling for EMI MitiUpgrade to support M-PHY v3.0 with HS-Gear3gation, Removal of D-PHY and SDL Reference
715:
relatively long-term vision about the expected or desired structure of the mobile handset industry, whereby components can readily interoperate and components from competing suppliers are to some degree
315:
The UniPro 1.0 specification was approved by the MIPI Board of Directors on January 14, 2008. UniPro 1.1, that was completed in July 2009, aims to improve readability, provides a reference model (in
246:
CSI-3: 3rd generation MIPI Camera Serial Interface features a scalable high bandwidth interface, a guaranteed data transmission and a command set for basic component initialization and configuration.
40:) is a high-speed interface technology for interconnecting integrated circuits in mobile and mobile-influenced electronics. The various versions of the UniPro protocol are created within the
939:
273:
UniPort-D (UniPro with D-PHY) : Enables general purpose extension with D-PHY, note that D-PHY is not a supported physical layer for UniPro beyond UniPro specification v1.41
761:
become self-sustaining. Although UniPro is backed by a number of major companies and that the UniPro incubation time is more or less in line with comparable technologies (
264:) are also supported and specifically encouraged because they tend to increase system-level modularity and interoperability due to their higher abstraction level.
963:
1133:
1127:
870:
The MICA (Mobile Interconnect-Centric Architectures) project, led by Peter van den Hamer, started within Philips but later became, via NXP, part of ST-Ericsson.
267:
UniPort-M (UniPro with M-PHY): Enables general purpose extension interface to connect peripheral devices such as graphic accelerators, modules such as Google's
828:
1011:
999:
339:
The UniPro protocol can support a wide range of applications and associated traffic types. Example chip-to-chip interfaces encountered in mobile systems:
975:
891:
879:
987:
1048:
915:
927:
903:
483:": support for a new physical layer technology. M-PHY v1.0 with HS-G1. Formal reference model for the whole stack. Peer Configuration. Versioning.
44:(Mobile Industry Processor Interface Alliance), an organization that defines specifications targeting mobile and mobile-influenced applications.
316:
793:
If the previous generation interconnect worked, there was some kind of solution. Consider reusing/tunneling/porting it with minimal changes.
249:
GBT: MIPI Gigabit Trace. A network independent protocol for transporting trace data over high-speed interfaces such as UniPort-M or USB3.0.
302:
These PHY technologies are covered in separate MIPI specifications (which are referenced by the UniPro specification. Note that the term
97:
109:
1151:
813:
Turn existing software interfaces into protocols. In some cases the transformation can be simple or even automated if the original
372:
high-quality audio samples (concerns: UniPro does not distribute a shared clock to all devices; UniPro complexity compared to e.g.
1177:
1083:
1182:
744:
105:
1197:
57:
858:
1187:
1049:"JEDEC Publishes Universal Flash Storage (UFS & UFSHCI) Version 3.0 and UFS Card Extension Version 1.1 | JEDEC"
951:
365:
low-bandwidth control - unless multiplexed with other traffic (concern: UniPro complexity is much higher than e.g.
796:
There are many reusable application-specific industry standards (like commands to control a radio, audio formats,
1172:
319:) for two of the four UniPro protocol layers, and provides features to facilitate automated conformance testing.
253:
219:
UniPro associated with its underlying PHY layer is a layered protocol stack that covers layers L1 to L4 of the
1095:
804:
355:
240:
1145:
53:
1192:
572:
480:
441:
291:
224:
80:
1025:"MIPI Alliance Releases MIPI UniPro v1.8 with Increased Performance and Improved Quality of Service"
461:"Hardened": formal reference models for 2 protocol layers; readability and testability improvements
627:
701:
5 (Session) and 6 (Presentation) are, where applicable, counted as part of the Application Layer.
120:
UniPro v1.4x specifications have been released together with a formal specification model (SDL).
1071:
766:
1074:, postulates that the value of a network is proportional to the square of the number of users
27:
1167:
716:
210:- since version 1.1, UniPro mandates features to facilitate automated conformance testing
71:
Schematic representation of a UniPro network connecting UniPro devices and circuit boards
440:
Limited changes compared to UniPro 1.0. All the basics for a chip-to-chip link via the
48:
1139:
1161:
41:
383:
interfaces to dynamic memory (concern: latency for processor instruction/data fetch)
290:
which can run on a wide range of lower-layer technologies. In the case of UniPro,
235:
UniPro's strict layering enables it to be used for a wide range of applications:
840:
736:
547:"Endpoint": fully networkable endpoint including inband configuration protocol.
268:
354:(e.g. chip-specific software drivers) or defining new industry standards (e.g.
75:
582:
UniPro protocol stack (this color-coding is a long-standing UniPro tradition)
361:
Applications which are currently believed to be less suitable for UniPro are:
964:
MIPI Alliance Specification for Processor Interface Emulation (PIE) v0.90.00
770:
698:
220:
67:
286:(L1, PHY) technologies even within a single network. This is analogous to
227:
between L1 and L2 which can be regarded as a sub-layer of OSI's layer L1.
336:
highly dependent on system design choices and interface implementation.
56:, error recovery) and robustness (proven networking concepts, including
373:
20:
287:
261:
204:- different traffic types and UniPro devices can share pins and wires
162:- can be used for a wide range of applications and data traffic types
377:
695:
PHY to be reused by other (less generic) protocols if needed(ref).
168:- from individual links to a network with up to 128 UniPro devices
1024:
282:
UniPro's layered architecture also allows it to support multiple
803:
Tunnel major technologies over UniPro. If you interact with the
797:
789:
Practical approaches thus call for a mix of several approaches:
748:
198:- provides features to manage congestion and control arbitration
814:
762:
740:
732:
366:
156:- serial technology with a number of bandwidth scaling options
113:
1000:
MIPI Alliance Standard for Unified Protocol v1.00.00 (UniPro)
131:
Specification for Device Descriptor Block (DDB), Version 1.0
180:- data errors detected and correctable via retransmission
349:
Chip-to-chip connectivity: 1 Gbit to 24 Gbit/s
739:
typically cost more than low speed interconnects (e.g.
1121:
1107:
657:
Single-hop reliability and priority-based arbitration
186:- can be implemented entirely in hardware where needed
1128:"MIPI Alliance announces M-PHY v2.0 and UniPro v1.41"
1124:- MIPI Alliance (document access requires an account)
96:
In 2004, both companies jointly founded what is now
940:
MIPI Alliance Specification for UniPro v1.4 Testing
192:- similar concepts to familiar network technologies
671:Physical layer abstraction and multi-lane support
551:Sharing of the link between several applications.
223:for networking. UniPro introduces an extra layer
685:Signaling, clocking, line encoding, power modes
343:Mass storage file transfer : 6 Gbit/s
79:Laboratory prototype of UniPro running on the
174:- optimized for small battery-powered systems
8:
1152:"JEDEC announces standard for flash storage"
988:MIPI Specification for M-PHY version 1.00.00
533:Upgrade to support M-PHY v4.1 with HS-Gear4
346:24M pixel camera @30fps : 9 Gbit/s
807:, it is sensible to provide IP-over-UniPro.
1142:- conformance and interoperability testing
1098:, requires an account at the MIPI website
1096:MIPI Membership Agreement November 1, 2006
1014:, requires an account at the MIPI website
1002:, requires an account at the MIPI website
990:, requires an account at the MIPI website
978:, requires an account at the MIPI website
966:, requires an account at the MIPI website
942:, requires an account at the MIPI website
930:, requires an account at the MIPI website
918:, requires an account at the MIPI website
906:, requires an account at the MIPI website
894:, requires an account at the MIPI website
882:, requires an account at the MIPI website
501:Upgrade to support M-PHY v2.0 with HS-G2
137:
678:
614:
600:
580:
391:
74:
66:
1148:- EE Times 2006 overview of MIPI status
851:
731:High speed interconnects like UniPro,
781:Availability of application protocols
47:The UniPro technology and associated
7:
128:Specification for M-PHY, Version 3.0
607:Payload and transaction semantics
14:
1146:"Mobile chip interface gets real"
859:Nokia's Discobus research project
422:Technology preview of UniPro 1.0
1086:, messaging protocol and library
294:are supported for off-chip use.
1134:"UniPro v1.41 Interoperability"
705:Discussion of value proposition
553:Dynamic Connection Management.
358:for memory-like transactions).
16:High-speed interface technology
549:"Switches": network switches.
1:
976:MIPI D-PHY 1.00 specification
710:UniPro and system integration
26:For the Russian company, see
916:UniPro 1.60.00 Specification
892:UniPro 1.41.00 Specification
880:UniPro 1.40.00 Specification
831:apply in all other domains.
817:have the right architecture.
687:
681:
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723:the mobile phone industry.
567:Protocol stack architecture
278:Alternative physical layers
252:DSI-2: 2nd generation MIPI
138:UniPro Versions and Roadmap
1214:
1130:- MIPI Alliance June 2012
570:
25:
18:
1136:- MIPI Alliance June 2012
829:RAND licensing conditions
586:
559:Real Time Traffic Class.
928:M-PHY v3.0 Specification
904:M-PHY v2.0 Specification
727:High bandwidth and costs
254:Display Serial Interface
19:Not to be confused with
1178:MIPI Alliance standards
954:Universal Flash Storage
331:Scope and applicability
241:Universal Flash Storage
1183:Mobile phone standards
1140:UniPro testing program
1108:MIPI Alliance web site
861:, led by Michel Gillet
84:
72:
54:differential signaling
682:Physical layer (PHY)
626:Ports, multiplexing,
573:UniPro protocol stack
231:Multiple applications
196:bandwidth utilization
78:
70:
58:congestion management
643:Addressing, routing
388:Versions and roadmap
292:two PHY technologies
215:Layered architecture
136:the technology (see
1198:Modular smartphones
583:
557:Security features.
221:OSI Reference Model
581:
516:30 September 2013
85:
73:
1188:Network protocols
767:Internet Protocol
692:
691:
564:
563:
419:26 February 2007
416:6 September 2006
190:software friendly
184:hardware friendly
1205:
1173:Embedded systems
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1012:UniPro 1.10 spec
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538:future releases
530:8 February 2018
473:31 January 2011
458:22 January 2010
437:14 January 2008
392:
88:History and aims
38:Unified Protocol
28:Unipro (company)
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1154:- EE Times 2011
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717:plug compatible
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596:Data unit name
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434:25 August 2007
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1072:Metcalfe's law
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578:technologies.
571:Main article:
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555:Hot Plugging.
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513:6 August 2013
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401:Formal release
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311:Phased roadmap
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148:Main features
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42:MIPI Alliance
39:
35:
29:
22:
1193:Serial buses
1122:www.MIPI.org
1103:
1091:
1079:
1067:
1056:. Retrieved
1052:
1043:
1032:. Retrieved
1029:www.mipi.org
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668:PHY adapter
628:flow control
604:Application
576:
548:
507:
489:
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404:Description
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841:Project Ara
737:PCI Express
688:PHY symbol
525:UniPro 1.8
495:4 May 2012
398:Text freeze
269:ARA Project
178:reliability
1162:Categories
1058:2018-01-31
1034:2021-04-19
847:References
747:or simple
699:OSI Layers
665:Layer 1.5
654:Data link
623:Transport
590:Layer name
952:JEDEC UFS
822:Licensing
771:Bluetooth
752:devices.
202:shareable
172:low-power
154:gigabit/s
835:See also
805:IP world
679:Layer 1
651:Layer 2
640:Network
637:Layer 3
632:Segment
620:Layer 4
610:Message
298:UniPorts
208:testable
166:scalable
646:Packet
587:Layer #
544:t.b.d.
541:t.b.d.
506:UniPro
488:UniPro
466:UniPro
448:UniPro
427:UniPro
409:UniPro
395:Version
374:SLIMbus
304:UniPort
160:generic
21:UniProt
1168:UniPro
660:Frame
288:TCP/IP
262:TCP/IP
34:UniPro
481:M-PHY
452:0.00
442:D-PHY
431:0.00
239:UFS:
81:D-PHY
1084:NoTA
815:APIs
798:MPEG
749:CMOS
615:DME
510:.00
508:1.60
492:.00
490:1.41
470:.00
468:1.40
413:.00
411:0.80
225:L1.5
110:PCIe
98:MIPI
36:(or
763:USB
745:SPI
741:I2C
735:or
733:USB
601:LA
450:1.1
429:1.0
378:I2S
376:or
367:I2C
356:UFS
317:SDL
140:).
114:USB
106:SPI
60:).
1164::
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1027:.
800:).
769:,
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719:.
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479:"
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369:)
256:.
104:(
52:(
30:.
23:.
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