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uses a special custom-designed TSMC-fabricated 28 nm coprocessor that has 24 Tensilica DSP cores. It has around 65 million logic gates, 8 MB of SRAM, and an additional layer of 1 GB of low-power DDR3
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announced its intent to buy
Tensilica for approximately $ 380 million in cash. Cadence completed the acquisition in April 2013, with a cash outlay at closing of approximately $ 326 million.
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738:"Tensilica HiFi 2 Audio DSP Supports HE AAC by Dolby in Digital Radio Mondiale; Now Offers Decoders for All Major International Digital Radio Standards"
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from
Cadence and over 100 software partners, Vision DSPs designed for imaging, video, computer vision, and neural networks, and the ConnX family of
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296:/sec neural network processors. All Cadence standard DSPs are based on the Xtensa architecture. The Xtensa architecture offers a user-customizable
780:"Tensilica's HiFi 3 DSP IP Core Provides Over 1.5x Better Performance for Audio Post Processing and Voice in Smartphones and Home Entertainment"
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HiFi EP Audio DSP — A superset of HiFi 2 with optimizations for DTS Master Audio, voice pre- and post-processing, and cache management
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http://ip.cadence.com/news/432/330/Cadence-Reports-First-Quarter-2013-Financial-Results-and-Completes-Acquisition-of-Tensilica
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Xtensa III — third-generation architecture, announced in June 2000; not less than 180 MHz in a 180 nm process
717:"Tensilica Introduces the Smallest, Lowest Power DSP IP Core For Always-Listening Voice Trigger and Voice Recognition"
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759:"Tensilica Introduces HiFi EP DSP Core for High Quality Audio in Home Entertainment and Smartphone Applications"
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Wi-Fi IoT SoCs use respectively the "Diamond
Standard 106Micro" (by Espressif referred to as "L106") and the LX6
897:"Cadence Unveils Industry's First Neural Network DSP IP for Automotive, Surveillance, Drone and Mobile Markets"
335:
Xtensa V — fifth-generation architecture, announced in August 2002; up to 350 MHz in a 130 nm process
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869:"New Cadence Tensilica Vision P5 DSP Enables 4K Mobile Imaging with 13X Performance Boost and 5X Lower Energy"
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HiFi 3 Audio DSP — 32-bit DSP for audio enhancement algorithms, wideband voice codecs, and multi-channel audio
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HiFi 4 DSP - Higher performance DSP for applications such as multi-channel object-based audio standards.
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is a 32-bit architecture with a compact 16- and 24-bit instruction set. The base instruction set has 82
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Five years later, Tensilica released support for flexible length instruction encodings, known as FLIX.
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through automated customization tools that can extend the Xtensa base instruction set, including
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Most recently he was chief architect at
Tensilica working on configurable/extensible processors.
883:"Cadence Announces New Tensilica Vision P6 DSP Targeting Embedded Neural Network Applications"
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and in very few of AMD's graphics cards, is based on the
Cadence Tensilica HiFi EP Audio DSP.
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HiFi 3z Audio DSP — For lower-powered audio, wideband voice codecs, and neural-network-based
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HiFi Mini Audio DSP — A small low power DSP core for voice triggering and voice recognition
687:"Tensilica Unveils Feature-Rich Third Generation Xtensa Configurable Processor Technology"
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VIA Technologies uses a HiFi DSP in an SoC for set top box, tablets, and mobile devices.
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Xtensa IV — fourth-generation product, announced in June 2001; with more tooling support
942:"Microsoft's HoloLens secret sauce: A 28nm customized 24-core DSP engine built by TSMC"
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1024:"Customer Spotlight: VIA Technologies Licenses Cadence Tensilica HiFi Audio/Voice DSP"
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HiFi 5 DSP - For digital assistants, infotainment, and voice-controlled products.
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to be included on the chip (IC) designs of products of their licensees, such as
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657:"Xtensa IV Widens Lead in Configurable & Extensible Processor Technology"
801:"Tensilica HiFi 3z DSP IP Core Provides Enhanced Voice and Audio Processing"
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Realtek standardized on the HiFi audio DSP for mobile and PC products.
17:
822:"Cadence Announces Fourth Generation Tensilica HiFi DSP Architecture"
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Tensilica was founded in 1997 by Chris Rowen (one of the founders of
1038:"Realtek Licenses Cadence's Tensilica HiFi Audio/Voice DSP IP Core"
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Vision P6 DSP, with 4X the peak performance of the Vision P5 DSP.
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Xtensa LX — sixth-generation architecture, announced in May 2004
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HiFi 2 Audio DSP — DSP core for low power MP3 audio processing
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Simplified block diagrams of HiFi audio engine and Xtensa LX
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cores. Its product lineup includes HiFi audio/voice DSPs (
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Xtensa processors range from small, low-power cache-less
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Vision C5 DSP, for neural network computational tasks.
265:. Tensilica processors are delivered as synthesizable
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Defunct semiconductor companies of the United States
1010:"Spreadtrum Licenses Tensilica HiFi Audio/Voice DSP"
627:"Xtensa V gets extended for networking and wireless"
237:). It employed Earl Killian, who contributed to the
64:, and by adding encyclopedic content written from a
911:"Everything You Wanted to Know About AMD TrueAudio"
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487:, meaning capable of being extended, and the word
241:, as director of architecture. On March 11, 2013,
439:Spreadtrum licensed the HiFi DSP for smartphones.
1104:Defunct computer companies of the United States
598:"Tensilica Xtensa LX Processor with Vectra LX"
455:In 1997, Tensilica was founded by Chris Rowen.
8:
226:DSPs which includes models such as the dual-
96:
592:
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102:
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84:Learn how and when to remove this message
269:for easy integration into chip designs.
201:semiconductor intellectual property core
123:Semiconductor intellectual property core
607:. Berkeley Design Technology, Inc. 2005
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230:ConnX D2 and the 64-MAC ConnX BBE64EP.
27:Semiconductor company in California, US
218:) with a software library of over 225
170:Microprocessors, HiFi audio, DSP cores
45:contains content that is written like
210:Tensilica offers customizable Xtensa
7:
582:https://0x04.net/~mwk/doc/xtensa.pdf
570:https://0x04.net/~mwk/doc/xtensa.pdf
328:, and one special-purpose register.
1109:Defunct computer hardware companies
320:instructions and includes a 32-bit
304:instructions, new register files.
25:
1074:Companies based in Silicon Valley
34:
1094:Fabless semiconductor companies
803:. circuitcellar.com. 2017-07-28
203:business. It is now a part of
1:
1099:Companies established in 1997
584:Chapter 3 "Core Architecture"
478:is a combination of the word
919:. 2013-10-08. Archived from
824:. prnewswire.com. 2015-01-06
546:Cadence to Acquire Tensilica
324:, 16 general-purpose 32-bit
465:acquired 100% of Tensilica.
346:HiFi audio and voice DSP IP
281:to high-performance 16-way
253:Cadence Tensilica develops
1125:
523:"S-1 Supercomputer Alumni"
249:Cadence Tensilica products
1089:Digital signal processors
273:Xtensa configurable cores
216:digital signal processors
101:
1084:Embedded microprocessors
986:"ESP32 SeriesDatasheet"
195:was a company based in
162:Chris Rowen, Jack Guedj
463:Cadence Design Systems
355:
308:Xtensa instruction set
243:Cadence Design Systems
205:Cadence Design Systems
142:Cadence Design Systems
962:"ESP8266EX Datasheet"
416:"Kaveri" desktop APUs
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66:neutral point of view
505:are primarily made.
410:, found e.g. in the
285:processors, 3-issue
152:San Jose, California
503:integrated circuits
98:
58:promotional content
761:. design-reuse.com
740:. design-reuse.com
719:. design-reuse.com
637:. 3 September 2002
422:Microsoft HoloLens
373:speech recognition
356:
60:and inappropriate
239:MIPS architecture
235:MIPS Technologies
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16:(Redirected from
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43:This section
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993:. Retrieved
991:. 2021-03-19
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969:. Retrieved
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947:The Register
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925:. Retrieved
921:the original
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851:. Retrieved
846:
843:"HiFi 5 DSP"
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826:. Retrieved
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784:. Retrieved
782:. 2012-01-11
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470:Company name
311:
292:cores, or 1
276:
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149:Headquarters
140:Acquired by
111:Company type
80:
71:
56:by removing
52:Please help
44:
847:cadence.com
701:3 September
691:cadence.com
671:3 September
661:cadence.com
641:3 September
631:eetimes.com
611:3 September
386:Vision DSPs
312:The Xtensa
74:August 2015
1068:Categories
995:2021-03-23
971:2021-03-23
927:2014-07-06
916:Maximum PC
828:2024-03-05
807:2024-03-05
786:2024-03-05
765:2024-03-05
744:2024-03-05
723:2024-03-05
528:2019-02-22
509:References
428:Espressif
255:SIP blocks
158:Key people
114:Subsidiary
54:improve it
853:4 October
849:. Cadence
501:of which
476:Tensilica
461:By 2013,
326:registers
635:EE Times
605:bdti.com
557:Source:
402:Adoption
224:baseband
182:.cadence
167:Products
119:Industry
695:Cadence
665:Cadence
499:element
494:silicon
450:History
430:ESP8266
199:in the
175:Website
144:in 2013
129:Founded
572:§1.2.2
497:, the
489:Silica
482:Tensil
220:codecs
18:Xtensa
989:(PDF)
965:(PDF)
601:(PDF)
491:from
434:ESP32
414:, in
855:2023
703:2020
673:2020
643:2020
613:2020
432:and
425:RAM.
318:RISC
302:SIMD
294:TMAC
287:VLIW
283:SIMD
261:for
184:.com
137:Fate
132:1997
322:ALU
290:DSP
267:RTL
228:MAC
1070::
944:.
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589:^
548:."
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180:ip
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