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Metallography

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507:(OI) technique, which was available on reflected light microscopes prior to about 1975. In OI, the vertical illuminator is offset from perpendicular, producing shading effects that reveal height differences. This procedure reduces resolution and yields uneven illumination across the field of view. Nevertheless, OI was useful when people needed to know if a second phase particle was standing above or was recessed below the plane-of-polish, and is still available on a few microscopes. OI can be created on any microscope by placing a piece of paper under one corner of the mount so that the plane-of-polish is no longer perpendicular to the optical axis. 109: 36: 166: 550:(WDS) is used. But quantification of composition by EDS has improved greatly over time. The WDS system has historically had better sensitivity (ability to detect low amounts of an element) and ability to detect low-atomic weight elements, as well as better quantification of compositions, compared to EDS, but it was slower to use. Again, in recent years, the speed required to perform WDS analysis has improved substantially. Historically, EDS was used with the SEM while WDS was used with the 411: 158: 395: 403: 150: 454:(hcp) crystal structures). If the specimen is prepared with minimal damage to the surface, the structure can be seen vividly in cross-polarized light (the optic axis of the polarizer and analyzer are 90 degrees to each other, i.e., crossed). In some cases, an hcp metal can be chemically etched and then examined more effectively with PL. Tint etched surfaces, where a thin film (such as a 675:(historically, E 45 covered only manual chart methods and an image analysis method for making such chart measurements was described in ASTM E 1122. The image analysis methods are currently being incorporated into E 45). A stereological method for characterizing discrete second-phase particles, such as nonmetallic inclusions, carbides, graphite, etc., is presented in ASTM E 1245. 558: 93: 431:(DF), is an alternative method of observation that provides high-contrast images and actually greater resolution than bright-field. In dark-field illumination, the light from features perpendicular to the optical axis is blocked and appears dark while the light from features inclined to the surface, which look dark in BF, appear bright, or "self-luminous" in DF. 634: 587:
But EDS and WDS are difficult to apply to particles less than 2-3 micrometers in diameter. For smaller particles, diffraction techniques can be performed using the TEM for identification and EDS can be performed on small particles if they are extracted from the matrix using replication methods to avoid detection of the matrix along with the precipitate.
256: 522:) is an optical technique that uses optically generated high frequency surface acoustic waves to probe the direction elastic parameters of the surface and, as such, it can vividly reveal the surface microstructure of metals. It can also image the crystallographic orientation and determine the single crystal elasticity matrix of the material. 354:(TEM) generally cannot be utilized at magnifications below about 2000 to 3000X. LOM examination is fast and can cover a large area. Thus, the analysis can determine if the more expensive, more time-consuming examination techniques using the SEM or the TEM are required and where on the specimen the work should be concentrated. 358: 586:
is best measured using XRD (ASTM E 975). If a particular phase can be chemically extracted from a bulk specimen, it can be identified using XRD based on the crystal structure and lattice dimensions. This work can be complemented by EDS and/or WDS analysis where the chemical composition is quantified.
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with a single size distribution) and E 1182 (specimens with a bi-modal grain size distribution); while ASTM E 1382 describes how any grain size type or condition can be measured using image analysis methods. Characterization of nonmetallic inclusions using standard charts is described in ASTM E 45
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to assess matrix and second-phase structures. Stereology is the field of taking 0-, 1- or 2-dimensional measurements on the two-dimensional sectioning plane and estimating the amount, size, shape or distribution of the microstructure in three dimensions. These measurements may be made using manual
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results in a better mount with superior edge retention. A typical mounting cycle will compress the specimen and mounting media to 4,000 psi (28 MPa) and heat to a temperature of 350 °F (177 °C). When specimens are very sensitive to temperature, "cold mounts" may be made with a
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fringes are not present to distort the image. However, the resolution limit of the LOM will not be better than about 0.2 to 0.3 micrometers. Special methods are used at magnifications below 50X, which can be very helpful when examining the microstructure of cast specimens where greater spatial
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Light microscopes are designed for placement of the specimen's polished surface on the specimen stage either upright or inverted. Each type has advantages and disadvantages. Most LOM work is done at magnifications between 50 and 1000X. However, with a good microscope, it is possible to perform
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on the surface to a depth where interference effects are created when examined with BF producing color images, can be improved with PL. If it is difficult to get a good interference film with good coloration, the colors can be improved by examination in PL using a sensitive tint (ST) filter.
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Further, certain features can be best observed with the LOM, e.g., the natural color of a constituent can be seen with the LOM but not with EM systems. Also, image contrast of microstructures at relatively low magnifications, e.g., <500X, is far better with the LOM than with the
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abrasive paper was the first method of grinding and is still used today. Many metallographers, however, prefer to use a diamond grit suspension which is dosed onto a reusable fabric pad throughout the polishing process. Diamond grit in suspension might start at 9
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procedures with the aid of templates overlaying the microstructure, or with automated image analyzers. In all cases, adequate sampling must be made to obtain a proper statistical basis for the measurement. Efforts to eliminate bias are required.
427:(BF) illumination, where the image of any flat feature perpendicular to the incident light path is bright, or appears to be white. But, other illumination methods can be used and, in some cases, may provide superior images with greater detail. 387:. A microscope with excellent resolution may not be able to image a structure, that is there is no visibility, if image contrast is poor. Image contrast depends upon the quality of the optics, coatings on the lenses, and reduction of flare and 491:. This system gives the best detail. DIC converts minor height differences on the plane-of-polish, invisible in BF, into visible detail. The detail in some cases can be quite striking and very useful. If an ST filter is used along with a 337:
Prepared specimens should be examined with the unaided eye after etching to detect any visible areas that have responded to the etchant differently from the norm as a guide to where microscopical examination should be employed.
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A systematic preparation method is the easiest way to achieve the true structure. Sample preparation must therefore pursue rules which are suitable for most materials. Different materials with similar properties
311:) the microstructure can be revealed without etching using crossed polarized light (light microscopy). Otherwise, the microstructural constituents of the specimen are revealed by using a suitable chemical or 161:
Cold mounting: The specimens are placed in a mounting cup and mounting material is then poured over the specimens. A vacuum impregnation unit (photo) is used for mounting of porous materials.
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Non-destructive surface analysis techniques can involve applying a thin film or varnish that can be peeled off after drying and examined under a microscope. The technique was developed by
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constituents can be seen with the microscope, e.g., inclusions and nitrides. If the crystal structure is non-cubic (e.g., a metal with a hexagonal-closed packed crystal structure, such as
342:(LOM) examination should always be performed prior to any electron metallographic (EM) technique, as these are more time-consuming to perform and the instruments are much more expensive. 530:
If a specimen must be observed at higher magnification, it can be examined with a scanning electron microscope (SEM), or a transmission electron microscope (TEM). When equipped with an
754:"Metallographic and Materialographic Specimen Preparation, Light Microscopy, Image Analysis and Hardness Testing", Kay Geels in collaboration with Struers A/S, ASTM International 2006. 495:, color is introduced. The colors are controlled by the adjustment of the Wollaston prism, and have no specific physical meaning, per se. But, visibility may be better. 272:
and finish at one micrometre. Generally, polishing with diamond suspension gives finer results than using silicon carbide papers (SiC papers), especially with revealing
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Example of a reusable pad for use with diamond suspension. A single magnetic platen is positioned on the grinding and polishing machine to support the preparation pads.
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For example, the amount of a phase or constituent, that is, its volume fraction, is defined in ASTM E 562; manual grain size measurements are described in ASTM E 112 (
546:, depends upon the nature of the detector used. But, quantification of these elements by EDS is difficult and their minimum detectable limits are higher than when a 610:
Microstructural quantification is performed on a prepared, two-dimensional plane through the three-dimensional part or component. Measurements may involve simple
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particles are used to remove material from the sample surface until the desired surface quality is achieved. Many different machines are available for doing this
484: 663:'s Committee E-4 on Metallography and some other national and international organizations, have developed standard test methods describing how to characterize 391:; but, it also requires proper specimen preparation and good etching techniques. So, obtaining good images requires maximum resolution and image contrast. 263:
After mounting, the specimen is wet ground to reveal the surface of the metal. The specimen is successively ground with finer and finer abrasive media.
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cloth to produce a scratch-free mirror finish, free from smear, drag, or pull-outs and with minimal deformation remaining from the preparation process.
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A number of techniques exist to quantitatively analyze metallographic specimens. These techniques are valuable in the research and production of all
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techniques, e.g., the measurement of the thickness of a surface coating, or the apparent diameter of a discrete second-phase particle, (for example,
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metals and alloys, measurement of the size and size distribution of particles, assessment of the shape of particles, and spacing between particles.
547: 276:, which silicon carbide paper sometimes "smear" over. After grinding the specimen, polishing is performed. Typically, a specimen is polished with a 534:(EDS), the chemical composition of the microstructural features can be determined. The ability to detect low-atomic number elements, such as 153:
Hot mounting: The specimens are placed in the mounting press, and the resin is added. The specimens are mounted under heat and high pressure.
531: 79: 57: 351: 554:(EMPA). Today, EDS and WDS is used with both the SEM and the EMPA. However, a dedicated EMPA is not as common as an SEM. 347: 198: 571: 174: 814: 646: 443: 414:
Cross-polarized light illumination, where sample contrast comes from rotation of polarized light through the sample
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Vol. 03.01 of the ASTM Standards covers standards devoted to metallography (and mechanical property testing)
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Metalog Guide, L. Bjerregaard, K. Geels, B. Ottesen, M. Rückert, Struers A/S, Copenhagen, Denmark, 2000.
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Metallography: Principles and Practice, G. F. Vander Voort, ASM International, Materials Park, OH, 1999.
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Besides considering the resolution of the optics, one must also maximize visibility by maximizing image
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Metallography and Microstructures, Vol. 9, ASM Handbook, ASM International, Materials Park, OH, 2005.
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present in a specimen if they have different crystal structures. For example, the amount of retained
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Bright-field illumination, where sample contrast comes from absorbance of light in the sample
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In some cases, the metallographic structure is large enough to be seen with the unaided eye
642: 492: 264: 574:(XRD) techniques for many years. XRD can be used to determine the percentages of various 394: 664: 583: 575: 432: 388: 300: 212:, which are able to meet different demands for quality, capacity, and reproducibility. 402: 808: 742: 293: 622: 138: 149: 726: 406:
Dark-field illumination, sample contrast comes from light scattered by the sample
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Mechanical preparation is the most common preparation method. Successively finer
650: 487:(DIC), which is usually obtained with a system designed by the Polish physicist 372: 312: 225: 137:
materials may also be prepared using metallographic techniques, hence the terms
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examination at higher magnifications, e.g., 2000X, and even higher, as long as
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two-part epoxy resin. Mounting a specimen provides a safe, standardized, and
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way by which to hold a sample during the grinding and polishing operations.
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The surface of a metallographic specimen is prepared by various methods of
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coverage in the field of view may be required to observe features such as
193:. Using only metallographic techniques, a skilled technician can identify 711:"Méthode non destructive d'examens macro et micrographiques superficiels" 618: 615: 543: 467: 446:(PL) is very useful when studying the structure of metals with non-cubic 304: 273: 231:
Metallographic specimens are typically "mounted" using a hot compression
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Characterization of microstructures has also been performed using
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Some of the most basic measurements include determination of the
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Scanning transmission electron microscope, used in metallography
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is becoming more popular because reduced shrinkage during
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is the study of the physical structure and components of
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An Introduction to Sample Preparation for Metallography
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Scanning electron and transmission electron microscopes
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An image of the microstructures of ductile cast iron
141:, plastography and, collectively, materialography. 625:). Measurement may also require application of 334:techniques are used in metallographic analysis. 185:. After preparation, it is often analyzed using 224:) will respond alike and thus require the same 799:Metallography Part II - Microscopic Techniques 645:of a phase or constituent, measurement of the 792:Metallography Part I - Macroscopic Techniques 479:Differential interference contrast microscopy 435:, for example, are more vivid in DF than BF. 8: 801:, Karlsruhe University of Applied Sciences. 794:, Karlsruhe University of Applied Sciences. 709:Jacquet, P. A.; van Effenterre, A. (1957). 423:Most LOM observations are conducted using 518:Spatially resolve acoustic spectroscopy ( 80:Learn how and when to remove this message 43:This article includes a list of general 701: 366:Design, resolution, and image contrast 7: 770:, 2nd Ed., ASM International, 1999. 503:DIC has largely replaced the older 548:wavelength-dispersive spectrometer 485:differential interference contrast 145:Preparing metallographic specimens 49:it lacks sufficient corresponding 25: 419:Bright- and dark-field microscopy 352:transmission electron microscopes 34: 27:Study of metals using microscopy 483:Another useful imaging mode is 532:energy dispersive spectrometer 1: 237:phenolic thermosetting resins 566:X-ray diffraction techniques 552:electron microprobe analyzer 348:scanning electron microscope 239:have been used, but modern 100:of bronze revealing a cast 836: 727:10.1051/metal/195754020107 591:Quantitative metallography 439:Polarized light microscopy 259:A macro etched copper disc 672:equiaxed grain structures 299:After polishing, certain 340:Light optical microscopy 797:Video on metallography 790:Video on metallography 787:, Cambridge University. 657:Standards organizations 561:An x-ray diffractometer 64:more precise citations. 768:Metallographic Etching 638: 562: 452:hexagonal close-packed 415: 407: 399: 362: 260: 210:grinding and polishing 170: 162: 154: 113: 105: 636: 560: 429:Dark-field microscopy 413: 405: 397: 360: 320:Pierre Armand Jacquet 258: 168: 160: 152: 111: 95: 715:Revue de Métallurgie 603:and non-metallic or 505:oblique illumination 499:Oblique illumination 450:(mainly metals with 322:and others in 1957. 228:during preparation. 685:Henry Clifton Sorby 605:composite materials 326:Analysis techniques 233:thermosetting resin 199:material properties 191:electron microscopy 661:ASTM International 639: 563: 448:crystal structures 416: 408: 400: 363: 261: 171: 163: 155: 114: 106: 815:Materials testing 572:x-ray diffraction 90: 89: 82: 16:(Redirected from 827: 747: 746: 706: 690:Holger F. Struer 667:quantitatively. 489:Georges Nomarski 433:Grain boundaries 85: 78: 74: 71: 65: 60:this article by 51:inline citations 38: 37: 30: 21: 835: 834: 830: 829: 828: 826: 825: 824: 805: 804: 783:HKDH Bhadeshia 780: 751: 750: 708: 707: 703: 698: 681: 665:microstructures 651:polycrystalline 643:volume fraction 593: 568: 528: 516: 514:SRAS microscopy 510: 501: 493:Wollaston prism 481: 470:film) is grown 444:Polarized light 441: 421: 368: 330:Many different 328: 301:microstructural 265:Silicon carbide 235:. In the past, 147: 86: 75: 69: 66: 56:Please help to 55: 39: 35: 28: 23: 22: 15: 12: 11: 5: 833: 831: 823: 822: 817: 807: 806: 803: 802: 795: 788: 779: 778:External links 776: 775: 774: 771: 764: 761: 758: 755: 749: 748: 721:(2): 107–125. 700: 699: 697: 694: 693: 692: 687: 680: 677: 592: 589: 584:hardened steel 567: 564: 527: 524: 515: 512: 500: 497: 480: 477: 440: 437: 420: 417: 367: 364: 327: 324: 146: 143: 88: 87: 42: 40: 33: 26: 24: 18:Metallographic 14: 13: 10: 9: 6: 4: 3: 2: 832: 821: 818: 816: 813: 812: 810: 800: 796: 793: 789: 786: 782: 781: 777: 772: 769: 765: 762: 759: 756: 753: 752: 744: 740: 736: 732: 728: 724: 720: 716: 712: 705: 702: 695: 691: 688: 686: 683: 682: 678: 676: 673: 668: 666: 662: 658: 654: 652: 648: 644: 635: 631: 628: 624: 620: 617: 613: 608: 606: 602: 598: 590: 588: 585: 581: 577: 573: 565: 559: 555: 553: 549: 545: 541: 537: 533: 525: 523: 521: 513: 511: 508: 506: 498: 496: 494: 490: 486: 478: 476: 473: 469: 466:or elemental 465: 461: 457: 453: 449: 445: 438: 436: 434: 430: 426: 418: 412: 404: 396: 392: 390: 386: 381: 379: 374: 365: 359: 355: 353: 350:(SEM), while 349: 343: 341: 335: 333: 325: 323: 321: 316: 314: 310: 306: 302: 297: 295: 291: 287: 283: 279: 275: 271: 266: 257: 253: 251: 246: 242: 238: 234: 229: 227: 223: 219: 213: 211: 207: 202: 200: 196: 192: 188: 184: 180: 176: 167: 159: 151: 144: 142: 140: 136: 132: 128: 126: 122: 118: 117:Metallography 110: 103: 99: 94: 84: 81: 73: 63: 59: 53: 52: 46: 41: 32: 31: 19: 767: 718: 714: 704: 669: 659:, including 655: 640: 623:ductile iron 609: 594: 569: 529: 517: 509: 502: 482: 442: 425:bright-field 422: 382: 369: 344: 336: 329: 317: 313:electrolytic 298: 262: 230: 214: 203: 197:and predict 172: 139:ceramography 129: 116: 115: 76: 67: 48: 766:G. Petzow, 472:epitaxially 373:diffraction 270:micrometres 226:consumables 123:, by using 70:August 2008 62:introducing 820:Metallurgy 809:Categories 696:References 647:grain size 627:stereology 616:spheroidal 332:microscopy 125:microscopy 98:micrograph 45:references 743:114572864 735:0035-1563 612:metrology 580:austenite 460:molybdate 378:dendrites 315:etchant. 250:ergonomic 222:ductility 179:polishing 135:polymeric 104:structure 102:dendritic 679:See also 619:graphite 544:nitrogen 468:selenium 464:chromate 385:contrast 274:porosity 218:hardness 206:abrasive 175:grinding 456:sulfide 294:napless 290:diamond 282:alumina 187:optical 183:etching 131:Ceramic 58:improve 741:  733:  601:alloys 597:metals 576:phases 542:, and 540:oxygen 536:carbon 286:silica 278:slurry 245:curing 195:alloys 181:, and 121:metals 47:, but 739:S2CID 582:in a 389:glare 292:on a 288:, or 241:epoxy 731:ISSN 599:and 520:SRAS 220:and 133:and 723:doi 649:in 621:in 307:or 280:of 189:or 811:: 737:. 729:. 719:54 717:. 713:. 607:. 538:, 462:, 458:, 380:. 309:Zr 305:Ti 284:, 201:. 177:, 127:. 96:A 745:. 725:: 216:( 83:) 77:( 72:) 68:( 54:. 20:)

Index

Metallographic
references
inline citations
improve
introducing
Learn how and when to remove this message

micrograph
dendritic

metals
microscopy
Ceramic
polymeric
ceramography



grinding
polishing
etching
optical
electron microscopy
alloys
material properties
abrasive
grinding and polishing
hardness
ductility
consumables

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