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attributed to the change of volume fraction of surface grains. In addition, the anisotropic properties of each grain become significant with the decrease of workpiece size, which results in the inhomogeneous deformation, irregular formed geometry and the variation of deformation load. There is a critical need to establish the systematic knowledge of microforming to support the design of part, process, and tooling with the consideration of size effects.
31:
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421:). The purpose of these thin films depends upon the type of device. Electronic devices may have thin films which are conductors (metals), insulators (dielectrics) or semiconductors. Optical devices may have films which are reflective, transparent, light guiding or scattering. Films may also have a chemical or mechanical purpose as well as for MEMS applications. Examples of deposition techniques include:
565:, and microcutting. These and other microforming processes have been envisioned and researched since at least 1990, leading to the development of industrial- and experimental-grade manufacturing tools. However, as Fu and Chan pointed out in a 2013 state-of-the-art technology review, several issues must still be resolved before the technology can be implemented more widely, including
119:
Simplified illustration of the process of fabrication of a CMOS inverter on p-type substrate in semiconductor microfabrication. Each etch step is detailed in the following image. The diagrams are not to scale, as in real devices, the gate, source, and drain contacts are not normally located in the
404:
can be used. For optical devices or flat panel displays, transparent substrates such as glass or quartz are common. The substrate enables easy handling of the micro device through the many fabrication steps. Often many individual devices are made together on one substrate and then singulated into
702:
Surface preparation is just a different viewpoint, all the steps are the same as described above: it is about leaving the wafer surface in a controlled and well known state before you start processing. Wafers are contaminated by previous process steps (e.g. metals bombarded from chamber walls by
492:
It is often desirable to pattern a film into distinct features or to form openings (or vias) in some of the layers. These features are on the micrometer or nanometer scale and the patterning technology is what defines microfabrication. This patterning technique typically uses a 'mask' to define
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to the material volume decreases with the decrease of specimen size and the increase of grain size. This leads to the decrease of grain boundary strengthening effect. Surface grains have lesser constraints compared to internal grains. The change of flow stress with part geometry size is partly
69:/lab-on-a-chip, optical MEMS (also called MOEMS), RF MEMS, PowerMEMS, BioMEMS and their extension into nanoscale (for example NEMS, for nano electro mechanical systems). The production of flat-panel displays and solar cells also uses similar techniques.
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size range to micrometer range, but they do not share the main idea of microelectronics-originated microfabrication: replication and parallel fabrication of hundreds or millions of identical structures. This parallelism is present in various
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Etching is the removal of some portion of the thin film or substrate. The substrate is exposed to an etching (such as an acid or plasma) which chemically or physically attacks the film until it is removed. Etching techniques include:
88:, ultra-precision engineering, fabrication processes, and equipment design. It is also giving rise to various kinds of interdisciplinary research. The major concepts and principles of microfabrication are
340:) portions of the film. Thin film metrology is used typically during each of these individual process steps, to ensure the film structure has the desired characteristics in terms of thickness (
34:
Synthetic detail of a micromanufactured integrated circuit through four layers of planarized copper interconnect, down to the polysilicon (pink), wells (greyish) and substrate (green)
679:
mixture (a.k.a. Piranha) removes organics. Hydrogen fluoride removes native oxide from silicon surface. These are all wet cleaning steps in solutions. Dry cleaning methods include
695:. Pre-gate cleaning is the most critical cleaning step in CMOS fabrication: it ensures that the ca. 2 nm thick oxide of a MOS transistor can be grown in an orderly fashion.
772:
Löper, Philipp; Stuckelberger, Michael; Niesen, Bjoern; Werner, Jérémie; Filipič, Miha; Moon, Soo-Jin; Yum, Jun-Ho; Topič, Marko; De Wolf, Stefaan; Ballif, Christophe (2015).
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a wide variety of other processes for cleaning, planarizing, or modifying the chemical properties of microfabricated devices can also be performed. Some examples include:
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1652:
289:
Microfabrication is actually a collection of technologies which are utilized in making microdevices. Some of them have very old origins, not connected to
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To fabricate a microdevice, many processes must be performed, one after the other, many times repeatedly. These processes typically include depositing a
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fabrication and integrated circuit technology are terms used instead of microfabrication, but microfabrication is the broad general term.
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774:"Complex Refractive Index Spectra of CH3NH3PbI3 Perovskite Thin Films Determined by Spectroscopic Ellipsometry and Spectrophotometry"
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718:: first they remove all unwanted bits and pieces, and then they reconstruct the desired pattern so that the game can go on.
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layers that constitute the final device. Modern microprocessors are made with 30 masks while a few masks suffice for a
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557:(MEMS) "parts or structures with at least two dimensions in the submillimeter range." It includes techniques such as
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Microfabricated devices are not generally freestanding devices but are usually formed over or in a thicker support
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Micro-scaled
Products Development via Microforming: Deformation Behaviours, Processes, Tooling and its Realization
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steps, and many others are performed. The complexity of microfabrication processes can be described by their
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Cleanrooms provide passive cleanliness but the wafers are also actively cleaned before every critical step.
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are micrometers in size, and their presence will destroy the functionality of a microfabricated device.
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Miniaturization of various devices presents challenges in many areas of science and engineering:
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Fu, M.W.; Chan, W.L. (2013). "A review on the state-of-the-art microforming technologies".
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Engel, U.; Eckstein, R. (2002). "Microforming - From Basic research to its realization".
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scales and smaller. Historically, the earliest microfabrication processes were used for
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portions of the film which will be removed. Examples of patterning techniques include:
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Nitaigour
Premchand Mahalik (2006) "Micromanufacturing and Nanotechnology", Springer,
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photography, with many patterns aligned to each other to create the final structure.
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are in use. Micromachining, semiconductor processing, microelectronic fabrication,
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1046:: Microelectronics and Nanometer Structures: Processing, Measurement, and Phenomena
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667:-peroxide solution removes organic contamination and particles; RCA-2 cleaning in
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techniques which have successfully been applied in the microregime. For example,
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Ultraclean
Surface Processing of Silicon Wafers: Secrets of VLSI Manufacturing
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Videos and animations on microfabrication techniques and related applications
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of DVDs involves fabrication of submicrometer-sized spots on the disc.
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from wafer boxes, and this might be different depending on wait time.
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882:"A review on micro-manufacturing, micro-forming and their key issues"
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Microfabricated devices are typically constructed using one or more
1324:. Silicon Processing for the VLSI Era. Vol. 1. Lattice Press.
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Fu, M.W.; Chan, W.L. (2014). "Chapter 4: Microforming
Processes".
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57:" or "semiconductor device fabrication". In the last two decades,
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Wafer cleaning, also known as "surface preparation" (see below)
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bake at elevated temperature to remove native oxide before
1422:
Meyrueis, P.; Sakoda, K.; Van de Voorde, M., eds. (2017).
1341:
The
Science and Engineering of Microelectronic Fabrication
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International
Journal of Advanced Manufacturing Technology
940:. Springer Science & Business Media. pp. 73–130.
915:"Process Analysis and Variation Control in Micro-stamping"
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plasma treatments to remove unwanted surface layers, or
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In microforming, the ratio of the total surface area of
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is also a 19th-century technique adapted to produce
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1393:Geschke, O.; Klank, H.; Telleman, P., eds. (2004).
1276:(6th ed.). McGraw-Hill. p. 1302905242.
1218:Plummer, J.D.; Deal, M.D.; Griffin, P.B. (2012).
405:separated devices toward the end of fabrication.
352:), for suitable device behavior. For example, in
217:Microfabrication technologies originate from the
1396:Microsystem Engineering of Lab-on-a-chip Devices
671:-peroxide mixture removes metallic impurities.
1653:Radio-frequency microelectromechanical systems
1191:Widmann, D.; Mader, H.; Friedrich, H. (2000).
1023:Journal of Micromechanics and Microengineering
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549:Microforming is a microfabrication process of
309:, and many of the vacuum techniques come from
221:industry, and the devices are usually made on
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27:Fabrication at micrometre scales and smaller
1293:Introduction to Microelectronic Fabrication
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1044:Journal of Vacuum Science and Technology B
1038:Journal of Vacuum Science and Technology A
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822:Journal of Materials Processing Technology
1668:Biological microelectromechanical systems
1343:(2nd ed.). Oxford University Press.
1007:Journal of Microelectromechanical Systems
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778:The Journal of Physical Chemistry Letters
248:Traditional machining techniques such as
1247:Fundamentals of Semiconductor Processing
123:
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61:(MEMS), microsystems (European usage),
1166:Micromanufacturing and Nanotechnology
1033:IEEE Transactions of Electron Devices
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1425:Micro- and Nanophotonic Technologies
1119:Micromachined Transducers Sourcebook
628:Microfabrication is carried out in
1658:Microoptoelectromechanical systems
573:(grain) structure and boundaries:
372:. This is the number of different
156:microoptoelectromechanical systems
25:
1193:Technology of Integrated Circuits
1018:Sensors and Actuators B: Chemical
1013:Sensors and Actuators A: Physical
609:Chemical-mechanical planarization
321:scale structures, as are various
137:Microfabricated devices include:
1811:Semiconductor device fabrication
1137:Brodie, I.; Muray, J.J. (1982).
1090:Fundamentals of Microfabrication
1061:Introduction to Microfabrication
624:Cleanliness in wafer fabrication
1318:Wolf, S.; Tauber, R.N. (2000).
1295:(2nd ed.). Prentice Hall.
1222:(2nd ed.). Prentice Hall.
1139:The Physics of Microfabrication
856:. CRC Press. pp. 263–282.
1520:Microelectromechanical systems
880:Razali, A.R.; Qin, Y. (2013).
356:fabrication there are some 30
348:) and extinction coefficient (
208:, energy harvesters/scavengers
152:microelectromechanical systems
59:microelectromechanical systems
1:
1472:MicroManufacturing Conference
1245:May, G.S.; Sze, S.S. (2004).
848:Dixit, U.S.; Das, R. (2012).
830:10.1016/S0924-0136(02)00415-6
707:), or they may have gathered
555:microelectromechanical system
384:. Microfabrication resembles
311:19th century physics research
899:10.1016/j.proeng.2013.02.086
854:Micromanufacturing Processes
850:"Chapter 15: Microextrusion"
567:deformation load and defects
364:steps, 20 etching steps, 10
53:fabrication, also known as "
1093:(2nd ed.). CRC Press.
250:electro-discharge machining
146:semiconductor manufacturing
55:semiconductor manufacturing
1837:
1627:Digital micromirror device
513:Etching (microfabrication)
510:
431:Local oxidation of silicon
260:have been scaled from the
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1201:10.1007/978-3-662-04160-4
1147:10.1007/978-1-4899-2160-4
1040:: Vacuum, Surfaces, Films
978:10.1007/s00170-012-4661-7
917:. Northwestern University
824:. 125–126 (2002): 35–44.
738:Semiconductor fabrication
532:deep reactive-ion etching
459:Physical vapor deposition
436:Chemical vapor deposition
239:semiconductor fabrication
1761:Shallow trench isolation
190:sensors (microsensors) (
45:miniature structures of
1546:Interdigital transducer
1339:Campbell, S.A. (2001).
1220:Silicon VLSI Technology
1116:Kovacs, G.T.A. (1998).
1064:(2nd ed.). Wiley.
852:. In Jain, V.K. (ed.).
254:spark erosion machining
128:Detail of an etch step.
1705:Surface micromachining
1604:Scratch drive actuator
1164:Mahalik, N.P. (2006).
1058:Franssila, S. (2010).
703:energetic ions during
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470:Evaporative deposition
129:
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1434:10.1002/9783527800728
1291:Jaeger, R.C. (2002).
1274:Microchip Fabrication
1272:van Zant, P. (2014).
1174:10.1007/3-540-29339-6
1099:10.1201/9781482274004
1070:10.1002/9781119990413
575:
344:), refractive index (
185:thin-film transistors
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1781:Silicon on insulator
1366:Hattori, T. (2011).
1087:Madou, M.J. (2002).
886:Procedia Engineering
528:reactive-ion etching
419:Thin film deposition
409:Deposition or growth
307:optics manufacturing
162:microfluidic devices
144:(“microchips”) (see
1740:3D microfabrication
1710:Bulk micromachining
728:3D microfabrication
540:or chemical etching
225:wafers even though
177:flat panel displays
142:integrated circuits
1715:HAR micromachining
1464:2022-02-06 at the
1405:10.1002/3527601651
1321:Process technology
305:was borrowed from
279:injection moulding
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51:integrated circuit
41:is the process of
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1256:978-0-471-23279-7
1229:978-0-13-614156-3
1210:978-3-662-04160-4
1079:978-1-119-99041-3
892:(2013): 665–672.
790:10.1021/jz502471h
669:hydrogen chloride
600:thermal diffusion
475:Electron beam PVD
426:Thermal oxidation
386:multiple exposure
82:materials science
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354:memory chip
295:lithography
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172:solar cells
154:(MEMS) and
120:same plane.
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1720:Deposition
1678:Micropower
1599:Comb drive
1551:Cantilever
803:2021-11-16
744:References
630:cleanrooms
598:by either
526:) such as
488:Patterning
465:Sputtering
415:thin films
392:Substrates
370:mask count
360:steps, 10
319:micrometre
262:millimeter
206:fuel cells
202:power MEMS
192:biosensors
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1786:Smart cut
1691:Processes
1591:Actuators
1428:. Wiley.
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1771:Lift-off
1749:Specific
1619:Switches
1462:Archived
1359:45209102
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1009:(J.MEMS)
1001:Journals
921:18 March
798:26263093
722:See also
709:polymers
689:hydrogen
677:peroxide
650:bacteria
638:humidity
323:stamping
275:moulding
231:plastics
1730:Etching
1698:General
1573:Sensors
693:epitaxy
665:ammonia
507:Etching
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374:pattern
338:etching
299:etching
293:, like
271:casting
267:imprint
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654:cells
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587:Other
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