404:, published on December 12, 2017, extends NV-DDR3 I/O speeds to 1066 MT/s and 1200MT/s. For better signaling performance, ONFI 4.1 adds Duty Cycle Correction (DCC), Read and Write Training for speeds greater than 800MT/s, support for lower pin cap devices with 37.5 Ohms default output resistance, and devices which require data burst exit and restart for long data input and output pauses. For lower power, 2.5V Vcc support is added. ONFI 4.1 also includes errata to the ONFI 4.0 specification.
416:, Published in May 2021, ONFI5.0 extends NV-DDR3 I/O speeds up to 2400MT/s. A new NV-LPDDR4 lower power interface is introduced with speeds up to 2400MT/s. With the NV-LPDDR4 interface, an optional Data Bus Inversion (DBI) feature is defined. New smaller footprint BGA-178b, BGA-154b and BGA-146b packages are added. ONFI5.0 also includes other errata related to the ONFI4.2 specification.
410:, published on February 12, 2020, extends NV-DDR3 I/O speeds to 1333MT/s, 1466MT/s and 1600MT/s. The BGA-252b four channel package is introduced which has a smaller footprint than the existing BGA-272b four channel package. To enable higher IOPS multi-plane operations, addressing restrictions related to multi-plane operations are relaxed.
150:, and accepted similar sets of low-level commands. As a result, when more capable and inexpensive models of NAND flash become available, product designers can incorporate them without major design changes. However, "similar" operation is not optimal: subtle differences in timing and command set mean that products must be thoroughly
424:
ONFI created the Block
Abstracted NAND addendum specification to simplify host controller design by relieving the host of the complexities of ECC, bad block management, and other low-level NAND management tasks. The ONFI Block Abstracted NAND revision 1.1 specification adds the high speed source
398:, published on April 17, 2014, introduced the NV-DDR3 interface increases the maximum switching speed from 533 MB/s to 800 MB/s, providing a performance boost of up to 50% for high performance applications enabled by solid-state NAND storage components.
234:
standard family by the late 1970s. These ICs are manufactured as commodity parts by a number of different vendors. This has allowed designers to freely mix 7400 components from different vendors—and even to mix components based on different
169:
Thus, one of the main motivations for standardization of NAND flash was to make it easier to switch between NAND chips from different producers, thereby permitting faster development of NAND-based products and lower prices via increased
386:, published in october of 2012, includes errata to the original ONFI 3.0 specification, adds LUN SET/GET Features commands, and implements additional data setup and hold values for NV-DDR2 interface.
146:
of flash memory was incorporated into consumer electronics, and production was expected to double by 2007. As of 2006, NAND flash memory chips from most vendors used similar packaging, had similar
433:
The NAND Connector
Specification was ratified in April 2008. It specifies a standardized connection for NAND modules (similar to DRAM DIMMs) for use in applications like caching and
1025:
298:
Version 1.0 of this specification was released on
December 28, 2006, and made available at no cost from the ONFI web site. Samsung was still not a participant. It specified:
34:
892:
283:, the world's largest manufacturer of NAND flash, was absent in 2006. Vendors of NAND flash-based consumer electronics and computing products are also members.
815:
866:
166:
of flash-based devices, and means they are likely to be incompatible with future models of NAND flash, unless and until their firmware is updated.
557:
1035:
1030:
202:. Product designers wanted newer NAND flash chips, for example, to be as easily interchangeable as hard disks from different manufacturers.
596:
425:
synchronous interface, which provides up to a 5X improvement in bandwidth compared with the traditional asynchronous NAND interface.
132:
format. Rather, ONFI seeks to standardize the low-level interface to raw NAND flash chips, which are the most widely used form of
219:
353:
346:
451:
1020:
739:"Perfectus Announces Industry's First SystemVerilog-based OVM Tested ONFi Verification IP for ONFi 2.1 Specification"
33:
307:
893:"ONFI Announces Publication of 4.0 Standard, Enabling a New Generation I/O with Lower Power and Higher Bandwidth"
1015:
324:
a standard mechanism for NAND chips to identify themselves and describe their capabilities (comparable to the
171:
951:
934:
738:
713:
685:
500:
816:"JEDEC and the Open NAND Flash Interface Workgroup Publish NAND Flash Interface Interoperability Standard"
325:
373:
113:
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568:
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so that it knows how to deal with differences in their interfaces. This increases the complexity and
211:
223:
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227:
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790:
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is expected to operate with various NAND flash chips, it must store a table of them in its
686:"Intel primes Flash standardisation push: Industry body formed to define common interface"
366:
was published in August 2010. It included a protocol called EZ-NAND that hid ECC details.
315:
311:
268:
191:
136:
372:
was published in March 2011. It required fewer chip-enable pins enabling more efficient
867:"ONFI Announces Publication of 3.2 Standard, Pushes Data Transfer Speeds to 533 MB/sec"
236:
163:
102:
1009:
841:
765:
292:
112:
and devices that communicate with them. The formation of ONFI was announced at the
714:"Vendors pledge to make Flash as easy to upgrade as RAM: Open Flash spec published"
690:
210:
The effort to standardize NAND flash may be compared to earlier standardization of
133:
109:
60:
446:
215:
129:
319:
195:
106:
98:
657:
183:
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622:
See section "The Curse of
Similarity" in this white paper by Arun Kamat of
276:
159:
20:
19:"ONFI" redirects here. For the medication under the brand name Onfi, see
251:
The ONFI consortium included manufacturers of NAND flash memory such as
280:
910:
303:
264:
147:
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and tested when a new model of flash chip is used in them. When a
558:"Open NAND Flash Interface: The First Wave of NAND Standardization"
335:
a standard command set for reading, writing, and erasing NAND flash
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among manufacturers. By 2006, NAND flash became increasingly a
603:
564:
530:
476:
392:, published on July 23, 2013, raised the data rate to 533 MB/s.
272:
240:
143:
239:, once the 74HCT sub-family become available (consisting of
341:
improved performance via a standard implementation of read
998:
952:"Open NAND Flash Interface Specification Revision 5.0"
935:"Open NAND Flash Interface Specification Revision 4.2"
72:
360:A verification product was announced in June 2009.
67:
56:
48:
40:
969:"Block Abstracted NAND specification version 1.1"
842:"NAND Flash Interface Interoperability: JEDSD230"
634:
632:
128:include the development of a new consumer flash
376:routing. A standard developed jointly with the
243:components with TTL-compatible logic levels).
501:"New Group Simplifies NAND Flash Integration"
352:improved data integrity by allowing optional
8:
1026:Standards organizations in the United States
295:for standard interface to NAND flash chips.
26:
338:standard timing requirements for NAND flash
101:of technology companies working to develop
766:"NAND specification adds error correction"
190:and consumer electronics products such as
32:
25:
551:
549:
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642:by Amber Huffman and Michael Abraham of
590:
588:
495:
493:
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87:Open NAND Flash Interface Working Group
27:Open NAND Flash Interface Working Group
658:"Simplify Your Flash-Memory Interface"
186:drives. It is incorporated into many
142:(chips); in 2006, nearly one trillion
597:"Simplifying Flash Controller Design"
7:
16:Association of electronic companies
14:
473:"ONFI web site presentation page"
791:"ONFI specification version 3.0"
764:Mark LaPedus (August 16, 2010).
656:Jim Cooke (September 25, 2006).
712:Tony Smith (January 22, 2007).
380:was published in October 2012.
302:a standard physical interface (
1:
1036:Organizations based in Oregon
1031:Technology trade associations
452:Common Flash Memory Interface
226:were originally produced by
97:with a lower case "i") is a
684:Tony Smith (May 11, 2006).
1054:
18:
822:. JEDEC. November 6, 2012
349:for NAND flash operations
326:Serial Presence Detection
31:
437:(SSDs) in PC platforms.
911:"Specifications - ONFi"
899:. ONFI. April 17, 2014.
206:Historical similarities
124:The group's goals did
873:. ONFI. July 23, 2013
420:Block Abstracted NAND
374:printed circuit board
354:error-correcting code
212:electronic components
114:Intel Developer Forum
606:.org. Archived from
567:.org. Archived from
306:) for NAND flash in
214:. For example, the
52:Industry trade group
1021:Non-volatile memory
507:. ONFI. May 9, 2006
230:, but had become a
224:integrated circuits
140:integrated circuits
28:
847:. October 30, 2012
663:Dr. Dobb's Journal
435:solid-state drives
200:solid-state drives
261:Micron Technology
228:Texas Instruments
188:personal computer
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999:Official website
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745:. June 22, 2009
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527:"ONFI FAQ page"
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991:External links
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974:. July 8, 2009
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356:(ECC) features
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345:and increased
339:
336:
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322:
310:-48, WSOP-48,
293:specifications
291:ONFI produced
288:
287:Specifications
285:
248:
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237:logic families
207:
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178:product, like
164:time-to-market
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103:open standards
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897:Press release
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877:September 13,
872:
871:Press release
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851:September 13,
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820:Press release
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749:September 13,
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743:Press release
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664:
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649:
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635:
633:
629:
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613:on 2012-02-19
609:
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595:Kamat, Arun.
591:
589:
585:
574:on 2012-02-19
570:
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511:September 13,
506:
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976:. Retrieved
963:
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918:. Retrieved
915:www.onfi.org
914:
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875:. Retrieved
870:
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773:. Retrieved
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747:. Retrieved
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733:
721:. Retrieved
718:The Register
717:
707:
695:. Retrieved
691:The Register
689:
679:
667:. Retrieved
661:
651:
640:presentation
615:. Retrieved
608:the original
576:. Retrieved
569:the original
535:. Retrieved
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509:. Retrieved
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481:. Retrieved
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134:non-volatile
125:
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110:flash memory
94:
90:
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61:Flash memory
447:NVM Express
414:Version 5.0
408:Version 4.2
402:Version 4.1
396:Version 4.0
390:Version 3.2
384:Version 3.1
370:Version 3.0
364:Version 2.3
347:concurrency
328:feature of
216:7400 series
196:MP3 players
172:competition
130:memory card
1010:Categories
920:2018-09-18
617:2010-07-31
578:2010-07-31
537:2010-07-31
483:2010-07-31
459:References
99:consortium
44:March 2006
638:See this
314:-52, and
184:hard disk
176:commodity
41:Formation
770:EE Times
441:See also
332:modules)
320:packages
277:Spansion
232:de facto
222:digital
160:firmware
152:debugged
21:clobazam
281:Samsung
247:Members
148:pinouts
120:History
68:Website
57:Purpose
644:Micron
304:pinout
265:Phison
198:, and
137:memory
972:(PDF)
955:(PDF)
938:(PDF)
845:(PDF)
794:(PDF)
624:Hynix
611:(PDF)
600:(PDF)
572:(PDF)
561:(PDF)
454:(CFI)
378:JEDEC
343:cache
330:SDRAM
257:Intel
253:Hynix
180:SDRAM
75:.onfi
980:2013
879:2013
853:2013
828:2013
802:2013
777:2013
751:2013
725:2013
699:2013
671:2013
604:ONFI
565:ONFI
533:.org
531:ONFI
513:2013
479:.org
477:ONFI
318:-63
308:TSOP
275:and
273:Sony
241:CMOS
107:NAND
105:for
95:ONFi
91:ONFI
85:The
77:.org
49:Type
316:BGA
312:LGA
220:TTL
218:of
182:or
144:MiB
126:not
93:or
73:www
1012::
913:.
895:.
869:.
818:.
768:.
741:.
716:.
688:.
660:.
631:^
602:.
587:^
563:.
546:^
529:.
503:.
492:^
475:.
279:.
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267:,
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89:(
23:.
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