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DEC V-11

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were received from the memory or the general purpose registers over the DAL bus, which is also used to write back results. It consisted of 29,600 transistors on a 341 mil by 288 mil die (8.66 mm by 7.32 mm) for an area of 98,208 mil (63.36 mm). It dissipated 2.5 W.
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The chips in the chip set were connected with four buses: the MIB, DAL, PAL and CAL. The MIB (microinstruction bus) carried microinstructions control signals and addresses from the control store to the I/E and F chips. The MIB is 40 bits wide, the same width as a microword and is
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The V-11 was a multichip design, mainly consisting of an I/E chip, a M chip, a F chip and five ROM/RAM chips. Unlike the MicroVAX 78032, which implemented a subset of VAX ISA, the V-11 was a complete VAX implementation, supporting all of the 304 instructions and 17
124:(byte, word, longword, quadword, octaword, F-floating, D-floating, G-floating, H-floating, bit, variable-length bit field, character string, trailing numeric string, leading separate numeric string, packed decimal string, absolute queue, and self-relative queue). 156:(CAM). The ROM contained the control store, with the RAM used to hold control store patches. The ROM/RAM consisted of 208,000 transistors on a die measuring 344 mils by 285 mils (8.74 mm by 7.24 mm) for an area of 98,040 mil (63.25 mm). It dissipated 1 W. 59:
held in 1984 alongside the MicroVAX 78032 and was introduced in early 1986 in systems, operating at 5 MHz (200 ns cycle time) and in 1987 at 6.25 MHz (160 ns cycle time). The V-11 was proprietary to DEC and was only used in their
207:(TLB). It contained five page table entries (PTEs), one for instruction and four for data. In the event of a miss, the backup translation buffer (BTB) in the M chip is used. The I/E chip consisted of 60,000 transistors on a 223:
and interrupt handling. It contained the backup translation buffer (BTB) tags, cache tags and internal processor registers. The M chip also contained the I/O functionality defined by the VAX architecture and generated the
292:. The F chip was supposed to be a completely new design developed for the V-11, but was cancelled in favor of a derivative as part of an effort to simplify the V-11 so it could be completed quicker as development of the 194:
instructions. It improved performance by maintaining a number of instructions ready for execution. The hardware attempted to keep the instruction buffer full at all times. The execution unit consisted of sixteen 32-bit
239:(PTEs), of which 256 were for system-space pages and 256 were for process-space pages. There are 128 BTB tags, one for every four PTEs, located in the M chip. The BTB was implemented with external RAMs. 245:
The M chip consisted of 54,000 transistors on a die measuring 339 mil by 332 mil (8.61 mm by 8.43 mm) for an area of 112,548 mil (72.61 mm). It dissipated 3 W.
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protected. The DAL is a 32-bit parity-protected bus that carries data and addresses to and from the I/E, M and F chips, cache, backup translation buffer RAMs and the port interface.
111:(CAD) suite and semiconductor process, the results of which are CHAS and ZMOS, respectively. ZMOS was the first semiconductor process to be developed entirely by DEC. 242:
There are 26 internal processor registers, which are used by the microcode for temporary storage when executing complex instructions requiring multiple cycles.
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process with two levels of interconnect. (The 'Z' in the name was chosen because it looked like a '2' -- having 2 layers of metal was notable.)
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measuring 354 mils by 358 mils (8.99 mm by 9.09 mm) for an area of 126,732 mil (81.76 mm). It dissipated 5 W.
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package. The package provided the complete control store as a unit for the processor; each of the five DC327 had different ROM contents.
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defined in the VAX architecture and was also responsible for executing integer divide and multiply instructions. The F chip received
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The V-11 was part of the Scorpio program, which aimed at providing DEC with the ability to develop and fabricate
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and a mini-translation buffer (MTB). The instruction buffer is a two-entry 32-bit buffer that held
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Five DC327 chips were mounted on a common ceramic carrier in a very characteristic, overly wide
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The V-11 was Digital's first VAX microprocessor design, but was the second to ship, after the
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A KA820-AA CPU module from a VAX 8200 minicomputer containing a V-11 microprocessor chip set
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from the I/E chip and microinstructions from the control store over the MIB bus.
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The V-11 chip set contained a total of 1,183,600 transistors spread over nine
269: 236: 171: 129: 80: 341:, Third Edition, April 1987". EK-KA820-TM-003. Digital Equipment Corporation. 1179: 1083: 1054: 940: 634: 629: 568: 433: 305: 121: 28:, code-named "Scorpio", is a miniprocessor chip set implementation of the 1190: 930: 925: 885: 664: 506: 501: 285: 73: 69: 65: 61: 1243: 1128: 1078: 1073: 1024: 910: 870: 865: 813: 277: 1276: 1196: 1184: 1049: 880: 875: 848: 843: 818: 760: 289: 273: 90: 1293: 1288: 1261: 1253: 1223: 1201: 1174: 1118: 1113: 1029: 935: 915: 860: 838: 823: 798: 778: 772: 766: 754: 749: 744: 738: 733: 728: 722: 717: 712: 707: 702: 697: 692: 686: 170: 107:(ICs). Other aspects of the program were the development of a new 15: 257:(FPU). It supported most VAX floating-point instructions and the 1158: 1143: 1138: 1133: 828: 681: 676: 670: 658: 558: 539: 534: 140:
The ROM/RAM chip (DC327) implemented one-fifth of the patchable
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Johnson, W.N.; Herrick, W.V.; Grundmann, W.J. (October 1984).
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The F chip was a derivative of the FPA, which belonged to the
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At 5 MHz, the V-11 performed approximately the same as the
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The I/E chip (DC328) contained an instruction buffer, a
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It was presented at the 39th 367:"A VLSI superminicomputer CPU" 304:The V-11 has an external 8 KB 1: 1124:Mass Storage Control Protocol 420:Digital Equipment Corporation 365:Johnson, W. (February 1984). 41:Digital Equipment Corporation 1214:Digital Federal Credit Union 436:(founder and CEO, 1957–1992) 233:translation lookaside buffer 205:translation lookaside buffer 101:very-large-scale integration 33:instruction set architecture 1258:Sequence and Batch Language 1219:Dynamic debugging technique 199:defined by the VAX ISA, an 1374: 1249:Record Management Services 1035:Standard Disk Interconnect 154:content-addressable memory 1302: 1283:The Ultimate Entrepreneur 459: 197:general purpose registers 946:DIGITAL Command Language 1272:Systems Research Center 1267:System Reference Manual 178:of V-11 I/E DC328 chips 152:RAM and a 32 by 14-bit 1358:32-bit microprocessors 1239:On-line Debugging Tool 179: 21: 353:"A VLSI VAX chip set" 201:arithmetic logic unit 174: 109:computer-aided design 19: 1229:Local Area Transport 987:National Replacement 150:random-access memory 35:(ISA) developed and 1353:DEC microprocessors 1089:Digital Linear Tape 448:(VP of engineering) 362:(5): 663–674. 255:floating-point unit 176:Semiconductor wafer 105:integrated circuits 1312:Computers template 237:page table entries 228:for the chip set. 180: 22: 1340: 1339: 643: 642: 221:memory management 94:superminicomputer 1365: 1330: 1329: 1320: 1319: 1310: 1309: 1104:Flip-Chip module 997:Special Graphics 484: 465: 454:(CEO, 1992–1998) 413: 406: 399: 390: 373:: 174–175. 268: 264: 260: 146:read-only memory 1373: 1372: 1368: 1367: 1366: 1364: 1363: 1362: 1343: 1342: 1341: 1336: 1298: 1163: 1059: 1006: 966:(Multinational) 950: 902: 895: 790: 783: 650: 639: 618: 563: 511: 477: 473: 472:Instruction set 466: 457: 440:Harlan Anderson 422: 417: 380: 348: 346:Further reading 334: 318: 302: 266: 262: 258: 251: 217: 169: 138: 117: 81:VAXstation 8000 49: 12: 11: 5: 1371: 1369: 1361: 1360: 1355: 1345: 1344: 1338: 1337: 1335: 1334: 1324: 1314: 1303: 1300: 1299: 1297: 1296: 1291: 1286: 1279: 1274: 1269: 1264: 1259: 1256: 1251: 1246: 1241: 1236: 1231: 1226: 1221: 1216: 1211: 1210: 1209: 1199: 1194: 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901:Programming 614:Alpha 21464 609:Alpha 21364 604:Alpha 21264 594:Alpha 21164 577:Alpha 21064 446:Gordon Bell 310:cache block 296:had begun. 115:Description 84:workstation 1347:Categories 1207:HP-Interex 630:MicroPRISM 479:processors 427:Key people 332:References 270:data types 267:g_floating 263:d_floating 259:f_floating 192:prefetched 122:data types 91:VAX-11/780 79:; and the 37:fabricated 1180:AltaVista 1084:DECwriter 1055:VAXBI bus 1002:Technical 978:(Turkish) 941:VAX MACRO 903:languages 789:Operating 671:VT50/VT52 651:terminals 635:StrongARM 434:Ken Olsen 1322:Category 1191:CPU Wars 1109:Gold key 1066:hardware 992:RADIX 50 931:MACRO-11 926:MACRO-10 649:Computer 316:Physical 278:Operands 167:I/E chip 74:VAX 8350 70:VAX 8300 66:VAX 8250 62:VAX 8200 1332:Commons 1244:PALcode 1129:PALcode 1099:Firefly 1079:DECtape 1074:DECtalk 1025:Massbus 972:(Greek) 911:BASIC-8 871:VAX/VMS 866:TOPS-20 814:TOPS-10 791:systems 598:21164PC 274:opcodes 103:(VLSI) 47:History 43:(DEC). 1277:TD/SMP 1197:DECnet 1185:Compaq 1064:Other 1050:Unibus 982:Hebrew 881:Ultrix 876:VAXELN 861:DSM-11 849:RSX-11 844:RSTS/E 834:DOS-11 819:RSX-15 804:4K DMS 799:DECsys 775:(1994) 769:(1993) 763:(1990) 761:VT1000 757:(1990) 741:(1987) 725:(1983) 689:(1978) 673:(1975) 667:(1972) 661:(1970) 552:Mariah 495:LSI-11 488:PDP-11 290:PDP-11 249:F chip 215:M chip 130:parity 1294:WPS-8 1289:VT640 1262:Sixel 1254:ReGIS 1224:FX!32 1202:DECUS 1175:AdvFS 1119:LK421 1114:LK201 1030:Q-Bus 936:MUMPS 921:FOCAL 916:DIBOL 839:RT-11 824:TSS/8 779:VT525 773:VT520 767:VT510 755:VT420 750:VT340 745:VT330 739:VT320 734:VT241 729:VT240 723:VT220 718:VT180 713:VT131 708:VT105 703:VT103 698:VT102 693:VT101 687:VT100 623:Other 587:21068 582:21066 569:Alpha 547:Rigel 300:Cache 186:, an 1159:TU81 1144:RL02 1139:RK05 1134:RA90 886:MICA 829:OS/8 682:VT62 677:VT55 665:GT40 659:VT05 559:NVAX 535:CVAX 525:V-11 507:J-11 502:T-11 498:F-11 326:NMOS 322:dies 286:J-11 265:and 72:and 26:V-11 24:The 854:IAS 809:COS 540:SOC 517:VAX 209:die 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Index


VAX
instruction set architecture
fabricated
Digital Equipment Corporation
MicroVAX 78032
International Solid State Circuits Conference
VAX 8200
VAX 8250
VAX 8300
VAX 8350
minicomputers
VAXstation 8000
workstation
VAX-11/780
superminicomputer
very-large-scale integration
integrated circuits
computer-aided design
data types
parity
control store
read-only memory
random-access memory
content-addressable memory
DIP

Semiconductor wafer
microsequencer
execution unit

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