38:
600:
156:. Saw singulation cuts a large set of packages in parts. In punch singulation, a single package is moulded into shape. The cross section shows a saw-singulated body with an attached thermal head pad. The lead frame is made of copper alloy and a thermally conductive adhesive is used for attaching the silicon die to the thermal pad. The silicon die is electrically connected to the lead frame by 1–2
133:
294:-9071A attempted to address this by focusing on 2nd level interconnects (i.e. package to PCB substrate). The challenge with this standard is that it has been more adopted by OEMs than component manufacturers, who tend to view it as an application-specific issue. As a result there has been much experimental testing and
241:, however this may affect overall reliability of the joints. Stencil design is another key parameter in QFN design process. Proper aperture design and stencil thickness can help produce more consistent joints (i.e. minimal voiding, outgassing, and floating parts) with proper thickness, leading to improved reliability.
338:
Different manufacturers use different names for this package: ML (micro-leadframe) versus FN (flat no-lead), in addition there are versions with pads on all four sides (quad) and pads on just two sides (dual), thickness varying between 0.9–1.0 mm for normal packages and 0.4 mm for extremely
236:
is able to bond to both the top and sides of the copper pad. The copper etching process also generally has tighter control than the solder masking process, resulting in more consistent joints. This does have the potential to affect the thermal and electrical performance of the joints, so it can be
206:
This package offers a variety of benefits including reduced lead inductance, a small sized "near chip scale" footprint, thin profile and low weight. It also uses perimeter I/O pads to ease PCB trace routing, and the exposed copper die-pad technology offers good thermal and electrical performance.
266:
Component packaging is often driven by the consumer electronics market with less consideration given to higher reliability industries such as automotive and aviation. It can therefore be challenging to integrate component package families, such as the QFN, into high reliability environments. QFN
194:
In contrast, the air-cavity QFN is usually made up of three parts; a copper leadframe, plastic-moulded body (open, and not sealed), and either a ceramic or plastic lid. It is usually more expensive due to its construction, and can be used for microwave applications up to 20–25 GHz.
655:. The die attach paddle is exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the circuit board. This also enables stable ground by use of down bonds or by electrical connection through a conductive die attach material.
257:
of 3 or higher is recommended. Several other issues with QFN manufacturing include: part floating due to excessive solder paste under the center thermal pad, large solder voiding, poor reworkable characteristics, and optimization of the solder reflow profile.
215:
Improved packaging technologies and component miniaturization can often lead to new or unexpected design, manufacturing, and reliability issues. This has been the case with QFN packages, especially when it comes to adoption by new non-consumer electronic
248:
can be a concern. If there is a large amount of moisture absorption into the package then heating during reflow can lead to excessive component warpage. This often results in the corners of the component lifting off the
900:
Wilde, J., and
Zukowski, E. "Comparative Analysis for μBGA and QFN Reliability." 8th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2007 IEEE,
937:
Serebreni, M., Blattau, N., Sharon, G., Hillman, C., Mccluskey, P. "Semi-analytical fatigue life model for reliability assessment of solder joints in qfn packages under thermal cycling". SMTA ICSR, 2017. Toronto,
305:
Serebreni et al. proposed a semi-analytical model to assess the reliability QFN solder joints under thermal cycling. This model generates effective mechanical properties for the QFN package, and calculates the
190:
Less-expensive plastic-moulded QFNs are usually limited to applications up to ~2–3 GHz. It is usually composed of just 2 parts, a plastic compound and copper lead frame, and does not come with a lid.
928:
Birzer, C., et al. "Reliability
Investigations of Leadless QFN Packages until End-of-Life with Application-Specific Board-Level Stress Tests." Electronics Components and Technology Conference, 2006.
314:
using a model proposed by Chen and Nelson. The dissipated strain energy density is then determined from these values and used to predict characteristic cycles to failure using a 2-parameter
662:(DRMLF) package. This is an MLF package with two rows of lands for devices requiring up to 164 I/O. Typical applications include hard disk drives, USB controllers, and wireless LAN.
791:
882:
Yan Tee, T., et al. "Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages." Microelectronics
Reliability 43 (2003): 1329–1338.
1023:
651:
plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the
855:
JEDEC JESD22B113, March 2006, Board Level
Cycling Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products
330:, but the leads do not extend out from the package sides. It is hence difficult to hand-solder a QFN package, inspect solder joint quality, or probe lead(s).
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1418:
756:
168:
805:
279:(CTE) mismatch as compared to leaded packages. For example, under accelerated thermal cycling conditions between -40 °C to 125 °C, various
891:
Vianco, P. and
Neilsen, M. K. "Thermal mechanical fatigue of a 56 I/O plastic quad-flat nolead (PQFN) package." SMTA International Conference, 2015.
910:
De Vries, J., et al. "Solder-joint reliability of HVQFN-packages subjected to thermal cycling." Microelectronics
Reliability 49 (2009): 331-339.
792:
http://www.dfrsolutions.com/hubfs/Resources/services/Understanding-Criticality-of-Stencil-Aperture-Design-and-Implementation-QFN-Package.pdf
207:
These features make the QFN an ideal choice for many new applications where size, weight, thermal and electrical performance are important.
1330:
1016:
725:
816:
873:
Syed, A. and Kang, W. "Board level assembly and reliability considerations for QFN type packages." SMTA International
Conference, 2003
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638:
276:
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Chen, W. T., and C. W. Nelson. "Thermal stress in bonded joints." IBM Journal of
Research and Development 23.2 (1979): 179-188.
919:
17. Li, L. et al. "Board level reliability and assembly process of advanced QFN packages." SMTA International
Conference, 2012.
237:
helpful to consult the package manufacturer for optimal performance parameters. SMD pads can be used to reduce the chances of
228:
Some key QFN design considerations are pad and stencil design. When it comes to bond pad design two approaches can be taken:
1061:
864:
IPC IPC-9701A, February 2006, Performance Test
Methods and Qualification Requirements for Surface Mount Solder Attachments
770:
http://www.dfrsolutions.com/hubfs/Resources/services/Manufacturing-and-Reliability-Challenges-With-QFN.pdf?t=1503583170559
1413:
283:(QFP) components can last over 10,000 thermal cycles whereas QFN components tend to fail at around 1,000-3,000 cycles.
1296:
1444:
It is relatively common to find packages that contain other components than their designated ones, such as diodes or
633:). These package generally have an exposed die attach pad to improve thermal performance. This package is similar to
806:
http://www.dfrsolutions.com/hubfs/Resources/services/The-Reliability-Challenges-of-QFN-Packaging.pdf?t=1502980151115
232:
defined (SMD) or non-solder mask defined (NSMD). A NSMD approach typically leads to more reliable joints, since the
1301:
1262:
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819:, Seelig, K., and Pigeon, K. "Overcoming the Challenges of the QFN Package," Proceedings of SMTAI, October, 2011.
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Design requirements for outlines of solid state and related products, JEDEC PUBLICATION 95, DESIGN GUIDE 4.23
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There are also issues on the manufacturing side. For larger QFN components, moisture absorption during
817:
http://www.aimsolder.com/sites/default/files/overcoming_the_challenges_of_the_qfn_package_rev_2013.pdf
275:. The significantly lower standoff in QFN packages can lead to higher thermomechanical strains due to
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72:. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a
637:(CSP) in construction. MLPD are designed to provide a footprint-compatible replacement for
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Integrated circuit package with contacts on all 4 sides, on the underside of the package
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A more recent design variation which allows for higher density connections is the
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circuits designs. It is available in 3 versions which are MLPQ (Q stands for
1372:
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QFN packages can have a single row of contacts or a double row of contacts.
298:
across various QFN package variants to characterize their reliability and
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1001:
290:, however this has primarily focused on die and 1st level interconnects.
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The pads of a saw-singulated package can either be completely under the
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The figure shows the cross section of a flat no-lead package with a
104:. Flat no-lead packages usually, but not always, include an exposed
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112:(into the PCB). Heat transfer can be further facilitated by metal
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https://www.microsemi.com/document-portal/doc_view/130006-qfn-an
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JEDEC JESD22-A105C, January 2011, Power and Temperature Cycling
41:
28-pin QFN, upside down to show contacts and thermal/ground pad
217:
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Historically, reliability testing has been mainly driven by
116:
in the thermal pad. The QFN package is similar to the
183:, with an air cavity designed into the package, and
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271:issues, especially thermomechanical fatigue due to
171:, or they can fold around the edge of the package.
76:, one of several package technologies that connect
828:JEDEC JESD22-A104D, May 2005, Temperature Cycling
211:Design, manufacturing, and reliability challenges
96:plastic encapsulated package made with a planar
553:and others (such as Atmel, ROHM Semiconductor)
436:quad flat no-lead package with top-exposed pad
1017:
8:
846:JEDEC JESD22-A106B, June 2004, Thermal Shock
712:Smaller Packages = Bigger Thermal Challenges
997:Linear Technology - QFN Package Users Guide
975:Edge Protection Technology for QFN Packages
30:"QFN" redirects here. For the airport, see
1419:List of integrated circuit packaging types
1024:
1010:
1002:
341:
267:components are known to be susceptible to
801:
799:
413:extremely thin dual flat no-lead package
1076:(SOD-123 / SOD-323 / SOD-523 / SOD-923)
689:
148:. There are two types of body designs,
755:: CS1 maint: archived copy as title (
748:
179:Two types of QFN packages are common:
64:) physically and electrically connect
961:Board mounting notes for QFN packages
674:Chip packaging and package types list
561:Heatsink Very-thin Quad Flat package
7:
403:ultra-thin dual flat no-lead package
108:to improve heat transfer out of the
187:with air in the package minimized.
326:The QFN package is similar to the
25:
639:small-outline integrated circuit
521:dual-row micro-leadframe package
277:coefficient of thermal expansion
1058:(DO-7 / DO-26 / DO-35 / DO-41)
993:magazine, July - August 2000.]
446:thin quad flat no-lead package
393:thin dual flat no-lead package
370:dual quad flat no-lead package
1:
501:micro-leadframe package micro
469:leadless plastic chip carrier
339:thin. Abbreviations include:
1448:in transistor packages, etc.
1414:Integrated circuit packaging
511:micro-leadframe package quad
491:micro-leadframe package dual
322:Comparison to other packages
715:, Microchip Technology Inc.
584:ultrathin quad flat no-lead
547:very thin quad flat no-lead
534:dual-row quad flat no-lead
483:Amkor Technology and Atmel
1482:
629:), and MLPD (D stands for
456:leadless leadframe package
362:Atmel, ROHM Semiconductor
255:moisture sensitivity level
128:Flat no-lead cross-section
29:
1442:
660:dual row micro lead frame
423:quad flat no-lead package
359:dual flat no-lead package
92:. Flat no-lead is a near
1429:Surface-mount technology
608:Micro lead frame package
603:Micro lead frame package
224:Design and manufacturing
106:thermally conductive pad
74:surface-mount technology
32:Narsaq Kujalleq Heliport
1434:Through-hole technology
571:ultra dual flat no-lead
296:finite element analysis
1064:(MELF / SOD-80 / LL34)
1033:Semiconductor packages
625:), MLPM (M stands for
614:QFN packages, used in
604:
460:National Semiconductor
137:
70:printed circuit boards
42:
1424:Printed circuit board
653:printed circuit board
610:(MLP) is a family of
602:
251:printed circuit board
135:
40:
1409:Electronic packaging
592:Microchip Technology
575:Microchip Technology
538:Microchip Technology
185:plastic-moulded QFNs
635:chip scale packages
66:integrated circuits
1446:voltage regulators
989:2011-09-30 at the
612:integrated circuit
605:
138:
58:dual-flat no-leads
50:quad-flat no-leads
43:
1453:
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1202:(Super-247) (SMT)
1196:(Super-220) (SMT)
1070:(SMA / SMB / SMC)
709:Bonnie C. Baker,
678:Quad flat package
641:(SOIC) packages.
597:
596:
588:Texas Instruments
551:Texas Instruments
328:quad flat package
281:quad flat package
150:punch singulation
118:quad-flat package
48:packages such as
16:(Redirected from
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984:ChipScale Review
979:Amkor Technology
970:Amkor Technology
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388:
385:
382:
380:
377:
376:
372:
369:
366:
365:
361:
358:
355:
354:
351:Manufacturer
350:
347:
344:
343:
340:
333:
331:
329:
321:
319:
317:
316:Weibull curve
313:
309:
303:
301:
297:
293:
289:
284:
282:
278:
274:
270:
261:
259:
256:
252:
247:
246:solder reflow
242:
240:
235:
231:
223:
221:
219:
210:
208:
201:
199:
196:
192:
188:
186:
182:
174:
172:
170:
165:
163:
159:
155:
151:
147:
143:
134:
127:
125:
123:
120:(QFP), and a
119:
115:
111:
107:
103:
99:
95:
91:
90:through-holes
87:
83:
79:
75:
71:
67:
63:
59:
55:
51:
47:
46:Flat no-leads
39:
33:
19:
1393:WL-CSP / WLP
1263:TSOP / HTSOP
1172:(DPAK) (SMT)
1166:(IPAK) (SMT)
1160:(TH / Panel)
1154:(TH / Panel)
1148:(TH / Panel)
1142:(TH / Panel)
1130:(TH / Panel)
1100:(TH / Panel)
943:
933:
924:
915:
906:
896:
887:
878:
869:
860:
851:
842:
833:
824:
812:
787:
776:
765:
740:. Retrieved
733:the original
720:
711:
705:
697:
692:
672:Chip carrier
659:
657:
644:
643:
630:
626:
622:
607:
606:
337:
325:
308:shear stress
304:
285:
265:
243:
227:
214:
205:
197:
193:
189:
184:
180:
178:
166:
153:
149:
146:wire bonding
139:
81:
61:
57:
53:
49:
45:
44:
1311:QUIP / QUIL
348:Description
262:Reliability
230:solder mask
1319:Grid array
1258:SOP / SSOP
1210:Single row
1093:SOT / TSOT
742:2008-09-26
684:References
619:electronic
302:behavior.
202:Advantages
162:gold wires
142:lead frame
94:chip scale
1373:Flip Chip
1292:QIP / QIL
1253:SO / SOIC
1243:Flat Pack
1238:DIP / DIL
1217:SIP / SIL
1085:3...5-pin
544:VQFN/WQFN
160:diameter
1460:Category
1282:Quad row
1226:Dual row
987:Archived
751:cite web
666:See also
334:Variants
88:without
82:surfaces
1052:(DO-27)
1040:Single
433:QFN-TEP
384:iC-Haus
345:Package
169:package
124:(BGA).
80:to the
1200:TO-274
1194:TO-273
1188:TO-268
1182:TO-263
1176:TO-262
1170:TO-252
1164:TO-251
1158:TO-247
1152:TO-220
1146:TO-202
1140:TO-126
1068:DO-214
1062:DO-213
1056:DO-204
1050:DO-201
558:HVQFN
531:DRQFN
373:Atmel
312:strain
234:solder
98:copper
56:) and
1351:Wafer
1134:TO-92
1128:TO-66
1122:TO-39
1116:TO-18
1042:diode
977:from
968:from
901:2007.
736:(PDF)
729:(PDF)
627:micro
518:DRMLF
400:UTDFN
288:JEDEC
18:HVQFN
1388:UICC
1331:eWLB
1297:PLCC
1248:MSOP
1136:(TH)
1124:(TH)
1118:(TH)
1112:(TH)
1110:TO-8
1106:(TH)
1104:TO-5
1098:TO-3
757:link
631:dual
623:quad
590:and
581:UQFN
568:UDFN
508:MLPQ
498:MLPM
488:MLPD
466:LPCC
443:TQFN
410:XDFN
390:TDFN
378:cDFN
367:DQFN
310:and
218:OEMs
158:thou
152:and
144:and
114:vias
86:PCBs
1378:PoP
1368:CSP
1364:COG
1361:COF
1358:COB
1341:PGA
1336:LGA
1326:BGA
1307:QFP
1302:QFN
1288:LCC
1273:ZIP
1233:DFN
1074:SOD
938:ON.
649:CSP
477:MLF
453:LLP
420:QFN
356:DFN
292:IPC
102:PCB
84:of
78:ICs
68:to
62:DFN
54:QFN
1462::
1383:QP
798:^
753:}}
749:{{
318:.
220:.
164:.
110:IC
1025:e
1018:t
1011:v
759:)
745:.
60:(
52:(
34:.
20:)
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