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82:). Thermal pads and thermal compound are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact; they would not be needed between perfectly flat and smooth surfaces. Thermal pads are relatively firm at room temperature, but become soft and are able to fill gaps at higher temperatures. Some, but not all, types of
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have included thermal pads on the bottom of heatsinks shipped with some of their processors, as they are cleaner and generally easier to install. However, thermal pads conduct heat less effectively than a minimal amount of thermal paste.
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Please note that HWlab's tests were conducted in an unusual scenario: using an
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AMD - Thermal
Interface Material Comparison: Thermal Pads vs. Thermal Grease
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