63:
378:
22:
125:
280:
in the molten solder pool can be very effective in disrupting the oxides on many metals, however, it is not effective when soldering to ceramics and glass since they themselves are oxides or other non-metal compound that cannot be disrupted since they are the base materials. In the cases of soldering
269:
while the piezoelectric crystal is thermally isolated, in order to prevent degradation of the piezoelectric element. Ultrasonic soldering iron tips can heat (up to 450 °C) while mechanically oscillating at 20—60 kHz. This soldering tip can melt solder filler metals as acoustic
297:
flux can be trapped or otherwise disrupt operation or contaminate clean production environments or there are dissimilar materials / metals / ceramic / glasses being joined. To be effective in adhering to surfaces, active solder's own nascent oxide on melting need to be disrupted and
281:
direct to glasses and ceramics, ultrasonic soldering filler metals need to be modified with active elements such as In, Ti, Hf, Zr and rare earth elements (Ce, La, and Lu). Solders when alloyed with these elements are called
273:
The acoustic energy created by the solder tip or ultrasonic solder pot works via cavitation of the molten solder which mechanically disrupts oxide layers on the solder layers themselves and on metal surfaces being joined.
238:. Ultrasonic welding uses ultrasonic energy to join parts without adding any kind of filler material while ultrasonic soldering uses external heating to melt filler metal materials, namely solders, to form a joint.
253:
or repair work. Initially, U/S soldering was aimed at joining aluminum and other metals; however, with the emergence of active solders, a much wider range of metals, ceramics and glass can now be soldered.
293:
The use of ultrasonic soldering is expanding, since it is clean and flux-less in combination with active solders being specified for joining assemblies where either
270:
vibrations are induced in the molten solder pool. The vibration and cavitation in the molten solder then permits solders to wet and adhere to many metal surfaces.
257:
Ultrasonic soldering uses either ultrasonically coupled heated solder iron tips (0.5—10 mm) or ultrasonically coupled solder baths. In these devices,
415:
146:
133:
35:
261:
are used to generate high frequency (20—60 kHz) acoustic waves in molten solder layers or batch, to mechanically disrupt
171:
106:
84:
49:
366:
408:
312:
Vianco, P.T.; Hosking, F.M.; Rejent, J.A. (1996). "Ultrasonic soldering for structural and electronic applications".
434:
401:
41:
361:
77:
71:
138:
207:, hard to solder metals and other sensitive components which cannot be soldered using conventional means.
88:
351:
265:
that form on the molten solder surfaces. The tips for ultrasonic soldering irons are also coupled to a
329:
314:
249:. In either case the process can be automated for large-scale production or can be done by hand for
444:
299:
439:
367:
Ultrasonic soldering of ceramics with indium—exemplary application with step-by-step images
235:
219:
204:
192:
258:
266:
356:
385:
242:
428:
246:
222:
to specialized electronic and sensor packages. It has been used since 1955 to solder
215:
203:, without the need for chemicals to solder materials, such as glass, ceramics, and
250:
377:
277:
200:
294:
196:
124:
341:
P. Vianco, AWS Soldering
Handbook, Ed. 3. 1999, published by the American
223:
285:
since they directly act on the glass/ceramic surfaces to create a bond.
210:
Ultrasonic soldering is finding growing application in soldering of
262:
211:
327:
Antonevich, J. (1976). "Fundamentals of
Ultrasonic Soldering".
118:
56:
15:
234:
Ultrasonic soldering is a distinctly different process than
241:
Ultrasonic soldering can be done with either a specialized
389:
409:
8:
352:soniKKs Ultrasonics Technology GmbH, Germany
50:Learn how and when to remove these messages
416:
402:
226:and other metals without the use of flux.
172:Learn how and when to remove this message
107:Learn how and when to remove this message
149:of all important aspects of the article.
70:This article includes a list of general
384:This electronics-related article is a
145:Please consider expanding the lead to
7:
374:
372:
357:Sanwa Components International, USA
76:it lacks sufficient corresponding
14:
31:This article has multiple issues.
376:
123:
61:
20:
137:may be too short to adequately
39:or discuss these issues on the
147:provide an accessible overview
1:
388:. You can help Knowledge by
461:
371:
214:and ceramics from solar
322:(11): 343-s thru 355-s.
91:more precise citations.
337:(7): 200-s thru 207-s.
259:piezoelectric crystals
300:ultrasonic agitation
185:Ultrasonic soldering
220:shape memory alloys
236:ultrasonic welding
199:process that uses
435:Electronics stubs
397:
396:
245:or a specialized
201:ultrasonic energy
182:
181:
174:
164:
163:
117:
116:
109:
54:
452:
418:
411:
404:
380:
373:
338:
323:
302:is well suited.
177:
170:
159:
156:
150:
127:
119:
112:
105:
101:
98:
92:
87:this article by
78:inline citations
65:
64:
57:
46:
24:
23:
16:
460:
459:
455:
454:
453:
451:
450:
449:
425:
424:
423:
422:
348:
330:Welding Journal
326:
315:Welding Journal
311:
308:
306:Further reading
291:
267:heating element
232:
178:
167:
166:
165:
160:
154:
151:
144:
132:This article's
128:
113:
102:
96:
93:
83:Please help to
82:
66:
62:
25:
21:
12:
11:
5:
458:
456:
448:
447:
442:
437:
427:
426:
421:
420:
413:
406:
398:
395:
394:
381:
370:
369:
364:
359:
354:
347:
346:External links
344:
343:
342:
339:
324:
307:
304:
290:
287:
283:active solders
243:soldering iron
231:
228:
180:
179:
162:
161:
141:the key points
131:
129:
122:
115:
114:
69:
67:
60:
55:
29:
28:
26:
19:
13:
10:
9:
6:
4:
3:
2:
457:
446:
443:
441:
438:
436:
433:
432:
430:
419:
414:
412:
407:
405:
400:
399:
393:
391:
387:
382:
379:
375:
368:
365:
363:
362:EWI, Ohio USA
360:
358:
355:
353:
350:
349:
345:
340:
336:
332:
331:
325:
321:
317:
316:
310:
309:
305:
303:
301:
296:
288:
286:
284:
279:
275:
271:
268:
264:
260:
255:
252:
248:
244:
239:
237:
229:
227:
225:
221:
217:
216:photovoltaics
213:
208:
206:
202:
198:
194:
190:
189:U/S soldering
186:
176:
173:
158:
155:February 2022
148:
142:
140:
135:
130:
126:
121:
120:
111:
108:
100:
90:
86:
80:
79:
73:
68:
59:
58:
53:
51:
44:
43:
38:
37:
32:
27:
18:
17:
390:expanding it
383:
334:
328:
319:
313:
292:
282:
276:
272:
256:
240:
233:
218:and medical
209:
188:
184:
183:
168:
152:
136:
134:lead section
103:
97:January 2019
94:
75:
47:
40:
34:
33:Please help
30:
251:prototyping
89:introducing
445:Ultrasound
429:Categories
278:Cavitation
247:solder pot
205:composites
72:references
36:improve it
440:Soldering
295:corrosive
197:soldering
139:summarize
42:talk page
289:Adoption
224:aluminum
230:Process
191:) is a
85:improve
263:oxides
212:metals
195:-less
74:, but
386:stub
193:flux
431::
335:55
333:.
320:75
318:.
45:.
417:e
410:t
403:v
392:.
187:(
175:)
169:(
157:)
153:(
143:.
110:)
104:(
99:)
95:(
81:.
52:)
48:(
Text is available under the Creative Commons Attribution-ShareAlike License. Additional terms may apply.
