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backplane with redundant ports. While SAS drives have two ports that can be used to connect to redundant paths or storage controllers, SATA drives only have a single port. Directly, they can only connect to a single controller or path. SATA drives can be connected to nearly all SAS backplanes without
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is an electrical interface routing between one socket or connection to another. The purpose of an interposer is to spread a connection to a wider pitch or to reroute a connection to a different connection.
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for flexible. Silicon and glass are also evaluated as an integration method. Interposer stacks are also a widely accepted, cost-effective alternative to
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ASME 2011 Pacific Rim
Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1
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Lau, John H. (2011-01-01). "The Most Cost-Effective
Integrator (TSV Interposer) for 3D IC Integration System-in-Package (SiP)".
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316:"SEMICON Singapore 3D IC Wrap-Up: Bring down the cost and bring out the TSV alternatives - 3D InCites"
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Interposer comes from the Latin word "interpĹŤnere", meaning "to put between". They are often used in
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interposes - definition of interposes by the Free Online
Dictionary, Thesaurus and Encyclopedia
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An interposer can be made of either silicon or organic (printed circuit board-like) material.
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98:. There are already several products with interposer technology in the market, notably the
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272:/ Rao R. Tummala, ChipScaleReview Volume 13, Number 4, July–August 2013, pages 18-19
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adapters, but using an interposer with a port switching logic allows providing path
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technology which combines small dies ("chiplets"), fabricated at the
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Another example of an interposer is the adapter used to plug a
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Layer between an integrated circuit and a printed circuit board
206:"Highlights of the TSMC Technology Symposium 2021 – Packaging"
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192:"TSMC to Expand CoWoS Capacity by 60% Yearly Through 2026"
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341:"The AMD Radeon R9 Fury X Review: Aiming For the Top"
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Pentium II: example of an interposer in dark yellow,
408:"Desktop, Nearline & Enterprise Disk Drives"
378:"Leti Unveils New 3D Network-on-Chip | EE Times"
263:2.5D Interposers; Organics vs. Silicon vs. Glass
244:Silicon interposers: building blocks for 3D-ICs
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110:demonstrated their second generation 3D-
78:A common example of an interposer is an
415:Storage Networking Industry Association
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447:This electronics-related article is a
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23:BGA with an interposer between the
451:. You can help Knowledge (XXG) by
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118:28 nm node, on a 65 nm
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180:Package Substrates/Interposers
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361:"White Paper: Virtex-7 FPGAs"
406:Willis Whittington (2007).
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158:Semiconductor fabrication
292:10.1115/ipack2011-52189
82:to BGA, such as in the
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25:integrated circuit die
73:high bandwidth memory
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104:Xilinx Virtex-7 FPGA
498:Integrated circuits
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286:. pp. 53–63.
268:2015-10-10 at the
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69:multi-chip modules
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253:/ ElectroIQ, 2011
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106:. In 2016,
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421:2014-09-22
392:2017-08-17
346:2017-08-17
326:2017-08-21
320:3D InCites
164:References
136:redundancy
102:, and the
84:Pentium II
67:packages,
54:interposer
92:polyimide
266:Archived
247:Archived
142:See also
108:CEA Leti
382:EETimes
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231:"2.5D"
96:3D ICs
411:(PDF)
364:(PDF)
116:FDSOI
449:stub
296:ISBN
127:SATA
120:CMOS
71:and
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131:SAS
112:NoC
88:FR4
65:BGA
52:An
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Text is available under the Creative Commons Attribution-ShareAlike License. Additional terms may apply.
