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38:
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Miniaturization became a trend in the last fifty years and came to cover not just electronic but also mechanical devices. The process for miniaturizing mechanical devices is more complex due to the way the structural properties of mechanical parts change as they are reduced in scale. It has been said
267:
initiative. The focus is to make components smaller to increase the number that can be integrated into a single wafer and this required critical innovations, which include increasing wafer size, the development of sophisticated metal connections between the chip's circuits, and improvement in the
166:), miniaturization was confined to two-dimensional electronic circuits used for the manipulation of information. This orientation is demonstrated in the use of vacuum tubes in the first general-purpose computers. The technology gave way to the development of
300:, engineers and designers have been exploring miniaturization to shrink components to the micro and nanometer range. Smaller devices can have lower cost, be made more portable (e.g.: for ambulances), and allow simpler and less invasive medical procedures.
561:
522:
550:
511:
216:, recognized that the ideal electrical and scaling characteristics of MOSFET devices would lead to rapidly increasing integration levels and unparalleled growth in
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155:
based on the succession of switching devices, each smaller, faster, and cheaper than its predecessor. During the period referred to as the
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293:(1969 – c. 2015) is based on economically viable technologies that can shrink three-dimensional objects.
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processes. These last two are the areas where miniaturization has moved into the nanometer range.
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171:
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224:, which he described in 1965, and which was later named after him, predicted that the number of
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The MOSFET was invented at Bell Labs between 1955 and 1960. It was the first truly compact
30:
This article is about the common change in machinery. For the science fiction element, see
260:
241:
106:
55:
450:
Siozios, Kostas; Anagnostos, Dimitrios; Soudris, Dimitrios; Kosmatopoulos, Elias (2018).
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that could be miniaturized and mass-produced for a wide range of uses, due to its
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on an IC for minimum component cost would double every 18 months. In 1974,
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217:
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110:
75:
352:
186:
42:
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854:
Advanced
Materials Innovation: Managing Global Technology in the 21st century
748:
702:
589:
Design of
Arithmetic Circuits in Quantum Dot Cellular Automata Nanotechnology
360:
945:
67:
17:
244:
rule. Moore described the development of miniaturization during the 1975
694:
485:
269:
252:
83:
770:. Berlin, Heidelberg: Springer-Verlag Berlin Heidelberg. p. 321.
733:
718:"Surface Protection and Selective Masking during Diffusion in Silicon"
86:
205:, with reduced cost-per-transistor as transistor density increased.
255:
IC chips with switching MOSFETs that had feature size as small as
213:
176:
36:
45:
620:
Nanostructuring
Operations in Nanoscale Science and Engineering
233:
551:"Excerpts from A Conversation with Gordon Moore: Moore's Law"
793:"The mechanisms for silicon oxidation in steam and oxygen"
917:. Philadelphia, PA: Chemical Heritage Press. p. 26.
390:"Tortoise of Transistors Wins the Race - CHM Revolution"
97:
chip doubling every two years, an observation known as
151:
The history of miniaturization is associated with the
27:
Trend to manufacture ever smaller products and devices
1090:. Westport, CT: Greenwood Publishing Group. pp.
978:. Thousand Oaks, CA: SAGE Publications. p. 440.
915:
Understanding Moore's Law: Four
Decades of Innovation
453:
IoT for Smart Grids: Design
Challenges and Paradigms
181:
Demonstrating a miniature television device in 1963.
512:"Cramming more components onto integrated circuits"
259:(nm) and development was also underway for chips a
1021:Streetman, Ben G.; Banerjee, Sanjay Kumar (2016).
654:Introduction to Micromechanisms and Microactuators
679:"Frosch and Derick: Fifty Years Later (Foreword)"
1054:Jha, B.B; Galgali, R.K.; Misra, Vibhuti (2004).
941:RF and Microwave Passive and Active Technologies
624:. New York: McGraw-Hill Companies Inc. pp.
545:
543:
506:
504:
1116:"Micro Moulding and Miniaturisation in MedTech"
41:Battery chargers for successive generations of
251:By 2004, electronics companies were producing
1086:Science in Popular Culture: A Reference Guide
677:Huff, Howard; Riordan, Michael (2007-09-01).
419:Colinge, Jean-Pierre; Colinge, C. A. (2005).
414:
412:
8:
1058:. New Delhi: Allied Publishers. p. 55.
327:
325:
797:Journal of Physics and Chemistry of Solids
652:Ghosh, Amitabha; Corves, Burkhard (2015).
753:Technical memorandum of Bell Laboratories
586:Sridharan, K.; Pudi, Vikramkumar (2015).
475:
473:
908:
906:
749:"Silicon-Silicon Dioxide Surface Device"
976:Encyclopedia of Nanoscience and Society
321:
722:Journal of The Electrochemical Society
248:, confirming his earlier predictions.
246:International Electron Devices Meeting
240:technology and formulated the related
1145:Miniaturization – Glossary definition
1077:
1075:
969:
967:
965:
828:Springer Science & Business Media
791:Ligenza, J.R.; Spitzer, W.G. (1960).
683:The Electrochemical Society Interface
647:
645:
427:Springer Science & Business Media
7:
999:McMenamin, Adrian (April 15, 2013).
913:Brock, David; Moore, Gordon (2006).
824:History of Semiconductor Engineering
768:History of Semiconductor Engineering
656:. Heidelberg: Springer. p. 32.
611:
609:
481:"Transistors Keep Moore's Law Alive"
135:List of semiconductor scale examples
938:Golio, Mike; Golio, Janet (2018).
121:, enabling the miniaturization of
25:
716:Frosch, C. J.; Derick, L (1957).
560:. 2005. p. 1. Archived from
521:. 1965. p. 4. Archived from
201:. This made it possible to build
153:history of information technology
1025:. Boston: Pearson. p. 341.
422:Physics of Semiconductor Devices
143:Semiconductor device fabrication
117:, faster performance, and lower
89:(MOS transistors) leads to the
1082:Van Riper, A. Bowdoin (2002).
1023:Solid state electronic devices
883:"Who Invented the Transistor?"
851:Moskowitz, Sanford L. (2016).
174:(IC) approach which followed.
1:
160:
1001:"The end of Dennard scaling"
809:10.1016/0022-3697(60)90219-5
157:Second Industrial Revolution
113:being built with increasing
334:"Through-Silicon Via (TSV)"
291:Third Industrial Revolution
80:scaling and miniaturization
1181:
353:10.1109/JPROC.2008.2007462
170:in the 1950s and then the
132:
29:
456:. Springer. p. 167.
197:, leading to increasing
888:Computer History Museum
592:. Springer. p. 1.
395:Computer History Museum
341:Proceedings of the IEEE
103:MOS integrated circuits
974:Guston, David (2010).
332:Motoyoshi, M. (2009).
182:
48:
32:Size change in fiction
859:John Wiley & Sons
616:Sharma, Karl (2010).
236:recognized the rapid
203:high-density IC chips
180:
133:Further information:
91:number of transistors
40:
1165:Technological change
1160:Industrial processes
1056:Futuristic Materials
861:. pp. 165–167.
528:on February 18, 2008
519:Electronics Magazine
263:in size through the
212:, who later founded
208:In the early 1960s,
567:on October 29, 2012
289:that the so-called
129:Electronic circuits
822:Lojek, Bo (2007).
766:Lojek, Bo (2007).
747:KAHNG, D. (1961).
695:10.1149/2.F02073IF
489:. 12 December 2018
298:medical technology
199:transistor density
183:
172:integrated circuit
123:electronic devices
115:transistor density
95:integrated circuit
78:, the exponential
49:
1032:978-1-292-06055-2
948:. pp. 18–5.
891:. 4 December 2013
777:978-3-540-34258-8
734:10.1149/1.2428650
558:Intel Corporation
230:Robert H. Dennard
195:power consumption
119:power consumption
72:engine downsizing
16:(Redirected from
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371:. Archived from
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278:photolithography
272:used for masks (
191:high scalability
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164: 1870–1914
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147:Transistor count
101:. This leads to
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284:Other fields
274:photoresists
250:
210:Gordon Moore
207:
184:
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111:memory chips
70:and vehicle
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51:
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1006:January 23,
803:: 131–136.
226:transistors
222:Moore's law
168:transistors
139:Moore's law
99:Moore's law
76:electronics
18:Miniaturize
1154:Categories
1101:0313318220
1065:8177646168
924:0941901416
728:(9): 547.
316:References
218:electronic
187:transistor
1041:908999844
946:CRC Press
703:1064-8208
361:0018-9219
276:) in the
68:computers
369:29105721
304:See also
270:polymers
193:and low
105:such as
895:20 July
493:18 July
486:EETimes
401:22 July
253:silicon
87:MOSFETs
84:silicon
56:Br.Eng.
43:Apple's
1126:18 May
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214:Intel
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1128:2023
1096:ISBN
1060:ISBN
1037:OCLC
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1008:2014
980:ISBN
950:ISBN
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897:2019
863:ISBN
832:ISBN
772:ISBN
699:ISSN
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630:ISBN
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573:2006
534:2006
495:2019
458:ISBN
431:ISBN
403:2019
357:ISSN
109:and
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