Knowledge (XXG)

Automated X-ray inspection

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metal parts in nuclear power stations) because the technology was expectedly very expensive in the beginning. But with wider adoption of the technology, prices came down significantly and opened automated x-ray inspection up to a much wider field- partially fueled again by safety aspects (e.g. detection of metal, glass or other materials in processed food) or to increase yield and optimize processing (e.g. detection of size and location of holes in cheese to optimize slicing patterns).
148:) where the connections are underneath the chip and not visible, means that ordinary optical inspection is impossible. Because the connections are underneath the chip package there is a greater need to ensure that the manufacturing process is able to accommodate these chips correctly. Additionally the chips that use BGA packages tend to be the larger ones with many connections. Therefore, it is essential that all the connections are made correctly. 116:
earliest possible state that materials are defective or process parameters got out of control, b) it prevents adding value to components that are already defective and therefore reduces the overall cost of a defect, and c) it increases the likelihood of field defects of the final product, because the defect may not be detected at later stages in quality inspection or during functional testing due to the limited set of test patterns.
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Whilst AOI is mainly associated with electronics manufacturing (due to widespread use in PCB manufacturing), AXI has a much wider range of applications. It ranges from the quality check of alloy wheels to the detection of bone fragments in processed meat. Wherever large numbers of very similar items
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With the advancement of image processing software the number applications for automated x-ray inspection is huge and constantly growing. The first applications started off in industries where the safety aspect of components demanded a careful inspection of each part produced (e.g. welding seams for
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Most of it is limited to a good/ bad check, i.e. it produces rejects after the AXI station, but in some applications it is directly used for process control where the data from the AXI are fed to the process and can control other variables. An often cited example is the control of the thickness of
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Foreign body detection, fill level control, and process control are the three main areas for the use of AXI in the food industry. Especially in packaged goods at the end of the filling and packaging line the use of X-ray scanners has become the norm, rather than the exception. It is often used in
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While optical inspection produces full color images of the surface of the object, x-ray inspection transmits x-rays through the object and records gray scale images of the shadows cast. The image is then processed by image processing software that detects the position and size/ shape of expected
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In mass production of complex items (e.g. in electronics manufacturing), an early detection of defects can drastically reduce overall cost, because it prevents defective parts from being used in subsequent manufacturing steps. This results in three major benefits: a) it provides feedback at the
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X-rays are generated by an x-ray tube, usually located directly above or below the object under inspection. A detector located the opposite side of the object records an image of the x-rays transmitted through the object. The detector either converts the x-rays first into visible light which is
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To achieve highest throughput, AXI machines use single 2D X-ray images where possible to make a decision. However, as the density of components on both sides of the PCB increases, it is harder to achieve a clear 2D image that is not obscured by other components. Techniques such as
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Janssens, E.; De Beenhouwer, J.; Van Dael, M.; De Schryver, T.; Van Hoorebeke, L.; Verboven, P.; Nicolai, B.; Sijbers, J. (2018). "Neural network Hilbert transform based filtered backprojection for fast inline X-ray inspection".
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inspection. AXI is able to find faults such as opens, shorts, insufficient solder, excessive solder, missing electrical parts, and mis-aligned components. Defects are detected and repaired within short debug time.
253:"Automated Radioscopic Inspection of Aluminum Die Castings", Domingo Mery, Departamento de Ciencia de la Computación Pontificia Universidad Católica de Chile Av. Vicuña Mackena 4860(183) Santiago de Chile 103:
Since the image is produced due to the different absorption of x-rays when passing through the object, it can reveal structures inside the object that are hidden from outside view.
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Van Dael, M.; Verboven, P.; Dhaene, J.; Van Hoorebeke, L.; Sijbers, J.; Nicolai, B. (2017). "Multisensor X-ray inspection of internal defects in horticultural products".
100:. The object under inspection may be imaged at higher magnification by moving the object closer to the x-ray tube, or at lower magnification closer to the detector. 182:
These inspection systems are more costly than ordinary optical systems, but they are able to check all the connections, even those underneaths the chip package.
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The following are related technologies and are also used in electronic production to test for the correct operation of electronics printed circuit boards.
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is to obtain the internal structure of the test object, and then observe the internal information of the test object without breaking the test object.
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cheese slices after an AXI determined the distribution and position of 'holes' inside the cheese block. (to ensure consistent total package weight).
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are often used to filter out background components by first creating a 3D model from multiple X-ray images taken from different angles.
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features (for process optimization) or presence/ absence of unexpected/ unintended objects or features (for anomaly detection).
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Janssens, E.; Alves Pereira, L.; De Beenhouwer, J.; Tsang, I.R.; Van Dael, M.; Verboven, P.; Nicolai, B.; Sijbers, J. (2018).
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Brosnan, Tadhg; Sun, Da-Wen (2004-01-01). "Improving quality inspection of food products by computer vision––a review".
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Automated X-ray inspection is used in a wide range of industries and applications, predominantly with two major goals:
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fragments in deboned poultry—model analysis Y Tao, JG Ibarra - Transactions of the ASAE, 200 - elibrary.asabe.org
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Anomaly detection, i.e. the result of the inspection serve as a criterion to reject a part (for scrap or re-work).
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Recently, automated methods have been developed for X-ray inspection of food passing by on a conveyor belt.
428:"Fast inline inspection by Neural Network Based Filtered Backprojection: Application to apple inspection" 63:
Process optimization, i.e. the results of the inspection are used to optimize following processing steps,
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X-ray of an electronic circuit board (zoom series into an old token ring network adapter board).
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Advanced Microcontroller Bus Architecture § Advanced eXtensible Interface (AXI)
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are produced according to a defined standard, automatic inspection using advanced
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As BGA connections are not visible, the only alternative is to use a low level
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combination with other QA measures, especially inline check weighers.
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imaged by an optical camera, or detects directly using an x-ray
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Case Studies in Nondestructive Testing and Evaluation
42:) is a technology based on the same principles as 158:AXI is often paired with the testing provided by 283:http://elibrary.asabe.org/abstract.asp?aid=2725 8: 255:http://www.ndt.net/article/v12n12/mery.pdf 443: 375: 22: 246: 136:Use of AXI in electronics manufacturing 7: 487:Printed circuit board manufacturing 401:Postharvest Biology and Technology 348:Measurement Science and Technology 14: 413:10.1016/j.postharvbio.2017.02.002 459:X-Ray Inspection for PCB and BGA 120:Use of AXI in the Food Industry 144:) with packages such as BGAs ( 1: 332:10.1016/S0260-8774(03)00183-3 140:The increasing usage of ICs ( 215:Automated optical inspection 44:automated optical inspection 445:10.1016/j.csndt.2016.03.003 320:Journal of Food Engineering 503: 52:as its source, instead of 15: 16:For the on-chip bus, see 368:10.1088/1361-6501/aa9de3 235:What is X-Ray Inspection 220:Functional testing (see 209:Joint Test Action Group 166:, and functional test. 299:www.x-rayinspection.us 265:Thickness-compensated 87:Principle of Operation 28: 26: 194:Related technologies 360:2018MeScT..29c4012J 142:integrated circuits 77:pattern recognition 222:acceptance testing 29: 494: 477:Hardware testing 461: 456: 450: 449: 447: 423: 417: 416: 396: 390: 389: 379: 342: 336: 335: 315: 309: 308: 306: 305: 291: 285: 263: 257: 251: 177: 153:X-ray inspection 73:image processing 51: 46:(AOI). It uses 35: 502: 501: 497: 496: 495: 493: 492: 491: 467: 466: 465: 464: 457: 453: 425: 424: 420: 398: 397: 393: 377:1854/LU-8551475 344: 343: 339: 317: 316: 312: 303: 301: 293: 292: 288: 264: 260: 252: 248: 243: 231: 203:In-circuit test 196: 175: 172: 164:in-circuit test 151:The process of 146:ball grid array 138: 122: 109: 89: 81:Computer vision 47: 33: 21: 12: 11: 5: 500: 498: 490: 489: 484: 479: 469: 468: 463: 462: 451: 418: 391: 337: 310: 286: 258: 245: 244: 242: 239: 238: 237: 230: 229:External links 227: 226: 225: 218: 212: 206: 195: 192: 171: 168: 137: 134: 121: 118: 108: 105: 88: 85: 68: 67: 64: 13: 10: 9: 6: 4: 3: 2: 499: 488: 485: 483: 480: 478: 475: 474: 472: 460: 455: 452: 446: 441: 437: 433: 429: 422: 419: 414: 410: 406: 402: 395: 392: 387: 383: 378: 373: 369: 365: 361: 357: 354:(3): 034012. 353: 349: 341: 338: 333: 329: 325: 321: 314: 311: 300: 296: 290: 287: 284: 280: 276: 272: 268: 262: 259: 256: 250: 247: 240: 236: 233: 232: 228: 223: 219: 216: 213: 210: 207: 204: 201: 200: 199: 193: 191: 189: 188:Tomosynthesis 183: 180: 169: 167: 165: 161: 160:boundary scan 156: 154: 149: 147: 143: 135: 133: 130: 126: 119: 117: 113: 106: 104: 101: 99: 93: 86: 84: 82: 78: 74: 65: 62: 61: 60: 57: 55: 54:visible light 50: 45: 41: 37: 25: 19: 454: 435: 431: 421: 404: 400: 394: 351: 347: 340: 323: 319: 313: 302:. Retrieved 298: 289: 278: 274: 270: 266: 261: 249: 197: 184: 181: 173: 157: 150: 139: 131: 127: 123: 114: 110: 107:Applications 102: 98:sensor array 94: 90: 69: 58: 39: 31: 30: 326:(1): 3–16. 471:Categories 304:2016-03-08 241:References 79:software ( 36:inspection 32:Automated 438:: 14–20. 407:: 33–43. 275:detection 386:54502005 273:imaging 356:Bibcode 170:Process 482:X-rays 384:  211:(JTAG) 162:test, 49:X-rays 382:S2CID 217:(AOI) 205:(ICT) 176:X-ray 34:X-ray 279:bone 75:and 440:doi 409:doi 405:128 372:hdl 364:doi 328:doi 277:of 40:AXI 473:: 434:. 430:. 403:. 380:. 370:. 362:. 352:29 350:. 324:61 297:. 271:ay 269:-r 448:. 442:: 436:6 415:. 411:: 388:. 374:: 366:: 358:: 334:. 330:: 307:. 267:X 224:) 38:( 20:.

Index

Advanced Microcontroller Bus Architecture § Advanced eXtensible Interface (AXI)

automated optical inspection
X-rays
visible light
image processing
pattern recognition
Computer vision
sensor array
integrated circuits
ball grid array
X-ray inspection
boundary scan
in-circuit test
Tomosynthesis
In-circuit test
Joint Test Action Group
Automated optical inspection
acceptance testing
What is X-Ray Inspection
http://www.ndt.net/article/v12n12/mery.pdf
http://elibrary.asabe.org/abstract.asp?aid=2725
"Application and Technology of X-ray Inspection in Processing and Manufacturing Industry"
doi
10.1016/S0260-8774(03)00183-3
Bibcode
2018MeScT..29c4012J
doi
10.1088/1361-6501/aa9de3
hdl

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