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Electron beam prober

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being probed. This affects the number of secondary electrons that escape the device surface and reach the detector. Since electrons are negatively charged, a conductor at a +5 volt potential inhibits the escape of electrons, while a 0 volt potential allows a greater number of electrons to reach the detector. By monitoring these changes in potential, a voltage and timing waveform may be produced for the signal at the point being probed.
31:. While a conventional SEM may be operated in a voltage range of 10–30 keV, the e-beam Prober typically operates at 1 keV. The e-beam prober is capable of measuring voltage and timing waveforms on internal semiconductor signal structures. Waveforms may be measured on metal line, polysilicon and diffusion structures that have an electrically active, changing signal. The operation of the prober is similar to that of a sampling 51:
During waveform acquisition mode, the primary electron beam is focused on a single point on the device surface. As the DUT cycles through its test pattern, the signal at the point being probed changes. The signal changes produce a corresponding change in the local electric field surrounding the point
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The e-beam prober generates an SEM image by raster-scanning a focused electron beam over a selected region of the semiconductor surface. The high energy electrons in the primary beam strike the surface of the silicon, producing a number of low energy secondary electrons. The secondary electrons are
35:. A continuously looping, repeating test pattern must be applied to the device-under-test (DUT). E-beam probers are used primarily for front side semiconductor analysis. With the advent of 48:
guided back up through the SEM column to a detector. The varying numbers of secondary electrons reaching the detector are interpreted to produce the SEM image.
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technology, many e-beam probers have been replaced with back side analysis instruments.
84: 25: 32: 36: 8: 62:Thong, J. (2004). "Electron Beam Probing". 20:is a specialized adaption of a standard 66:. ASM International. pp. 438–443. 7: 18:electron beam prober (e-beam prober) 14: 64:Microelectronics Failure Analysis 1: 22:scanning electron microscope 117: 96:Reliability engineering 24:(SEM) that is used for 101:Semiconductor analysis 43:Theory of operation 108: 77: 29:failure analysis 116: 115: 111: 110: 109: 107: 106: 105: 81: 80: 74: 61: 58: 45: 12: 11: 5: 114: 112: 104: 103: 98: 93: 83: 82: 79: 78: 72: 57: 54: 44: 41: 13: 10: 9: 6: 4: 3: 2: 113: 102: 99: 97: 94: 92: 91:Electron beam 89: 88: 86: 75: 73:0-87170-804-3 69: 65: 60: 59: 55: 53: 49: 42: 40: 38: 34: 30: 27: 26:semiconductor 23: 19: 63: 50: 46: 33:oscilloscope 17: 15: 85:Categories 56:References 37:flip-chip 70:  68:ISBN 16:The 87:: 76:.

Index

scanning electron microscope
semiconductor
failure analysis
oscilloscope
flip-chip
ISBN
0-87170-804-3
Categories
Electron beam
Reliability engineering
Semiconductor analysis

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