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The consistency of thermal paste makes it susceptible to failure mechanisms distinct from some other thermal interface materials. A common one is pump-out, which is the loss of thermal paste from between the die and the heat sink due to their differing rates of thermal expansion and contraction. Over
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are able to, in a process known as "delidding", pry the heat spreader, or CPU "lid", from the die. This allows them to replace the thermal paste, which is usually of low-quality, with a thermal paste having greater thermal conductivity. Generally, liquid metal thermal pastes are used in such
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Zinc oxide emits toxic fumes that must not be inhaled and a particulate respirator is necessary for any use. The chemical is also highly toxic to aquatic organisms and may cause long-term negative effects to aquatic environments.
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silver particles suspended in a silicone/ceramic medium. However, metal-based thermal paste can be electrically conductive and capacitive; if some flows onto the circuits, it can lead to malfunction and damage.
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Thermal paste is used to improve the heat coupling between different components. A common application is to drain away waste heat generated by electrical resistance in semiconductor devices including power
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Another issue with some compounds is the separation of the polymer and filler matrix components occurs under high temperatures. The loss of polymeric material can result in poor
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and laptops (though seldom tablets or smartphones) typically incorporate thermal paste between the top of the CPU case and a heat sink for
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liquid matrix and large volume fractions of electrically insulating, but thermally conductive filler. Typical matrix materials are
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11th
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2008: ITHERM 2008: 28–31 May 2008
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of the base matrix from 0.17–0.3 W/(m·K) (watts per meter-kelvin) up to about 4 W/(m·K), according to a 2008 paper.
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are used as fillers for these types of adhesives. The filler loading can be as high as 70–80% by mass, and raises the
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When a CPU heat spreader is coupled to the die via thermal paste, performance enthusiasts such as
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Silver thermal compounds may have a conductivity of 3 to 8 W/(m·K) or more, and consist of
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devices. The main role of thermal paste is to eliminate air gaps or spaces (which act as
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of the device due to the negative temperature coefficient property of semiconductors.
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MX-2 and MX-3, Tuniq TX-3, Cool
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Several containers of thermal paste of different brands. From left to right:
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Viswanath, Ram; Wakharkar, Vijay; Watwe, Abhay; Lebonheur, Vassou (2000).
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Narumanchi, Sreekant; Mihalic, Mark; Kelly, Kenneth; Eesley, Gary (2008).
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The most effective (and most expensive) pastes consist almost entirely of
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Thermal paste is designed to fill imperfections on the surface of a chip.
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401:"Thermal interface materials for power electronics applications"
460:"Thermal Performance Challenges from Silicon to Systems"
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27:Fluid used to maximize thermal contact
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431:"What is delidding? - ekwb.com"
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362:List of thermal conductivities
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18:Thermal interfacial materials
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295:is sometimes used instead.
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155:thermal interface material
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549:Computer hardware cooling
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496:"ICSC 0208 - ZINC OXIDE"
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441:2018-10-18
368:References
307:Challenges
264:, and LED
221:micronized
206:zinc oxide
135:heat sinks
119:CPU grease
107:heat paste
539:Adhesives
291:, though
241:aluminium
233:galinstan
194:acrylates
190:urethanes
182:silicones
435:ekwb.com
336:See also
287:and its
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480:8 March
281:cooling
237:gallium
178:epoxies
121:) is a
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293:solder
192:, and
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463:(PDF)
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482:2020
266:COBs
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