264:). Each has advantages and limitations. Using interposers to connect several ICs instead of connecting several monolithic ICs in separate packages reduces the power needed to transmit signals between ICs, increases the number of transmission channels, and reduces delays caused by resistance and capacitance (RC delays). However, communication between chiplets consumes more power and has higher latency than components within monolithic ICs.
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A relatively new development in MCM technology is the so-called "chip-stack" package. Certain ICs, memories in particular, have very similar or identical pinouts when used multiple times within systems. A carefully designed substrate can allow these dies to be stacked in a vertical configuration
839:
Slyusar V. I., Slyusar D.V. Pyramidal design of nanoantennas array. // VIII International
Conference on Antenna Theory and Techniques (ICATT’11). - Kyiv, Ukraine. - National Technical University of Ukraine “Kyiv Polytechnic Institute”. - September 20–23, 2011. - Pp. 140 - 142.
237:. Multiple copies of the same IC are used to build the final product. In the case of POWER5, multiple POWER5 processors and their associated off-die L3 cache are used to build the final package. With the Core 2 Quad, effectively two Core 2 Duo dies were packaged together.
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making the resultant MCM's footprint much smaller (albeit at the cost of a thicker or taller chip). Since area is more often at a premium in miniature electronics designs, the chip-stack is an attractive option in many applications such as cell phones and
196:(PCB) meant to mimic the package footprint of an existing chip package to fully custom chip packages integrating many chip dies on a high density interconnection (HDI) substrate. The final assembled MCM substrate may be done in one of the following ways:
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and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or
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169:". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach.
192:
Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from using pre-packaged ICs on a small
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ICs that can perform most, if not all of the functions of a component of a computer, such as the CPU. Examples of this include implementations of IBM's
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ICs that perform only some of the functions, or "Intellectual
Property Blocks" ("IP Blocks"), of a component in a computer. These are known as
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and a thinning process, as many as ten dies can be stacked to create a high capacity SD memory card. This technique can also be used for
893:
Burns, M. J.; Char, K.; Cole, B. F.; Ruby, W. S.; Sachtjen, S. A. (1993). "Multichip module using multilayer YBa2Cu3O7−δinterconnects".
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Ghoshal, U.; Van Duzer, T. (1992). "High-performance MCM interconnection circuits and fluxoelectronics".
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connects the ICs. This is often either organic (a laminated circuit board that contains carbon, hence
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architecture are MCMs of one, two, four or eight chips containing CPU cores and one bigger I/O chip
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The possible way to increasing the performance of data transfer in the Chip stack is use
Wireless
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technology. A FCMCM may have one large die and several smaller dies all on the same module.
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Electronic assembly containing multiple integrated circuits that behaves as a unit
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1047:"AMD Ryzen Threadripper 3960X, 3970X Meet Scalpel For Zen 2 Delidding Operation"
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architecture are MCMs with one GCD and up to six memory cache die (MCD) chips.
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810:"Intel migrates to desktop Multi-Chip Modules (MCMs) with 14nm Broadwell"
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1022:"The AMD Ryzen Threadripper 1950X and 1920X Review: CPUs on Steroids"
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architecture are MCMs of one or two graphics compute die (GCD) chips.
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processor dies (center) and four 36 MB L3 cache dies (periphery)
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1072:"AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome"
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244:. An example of this are the processing ICs and I/O IC of AMD's
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Multichip Module
Technology (MCM) or System on a Package (SoP)
711:"IMAPS Advancing Microelectronics 2020 Issue 3 (Advanced SiP)"
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29:
854:
Proceedings 1992 IEEE Multi-Chip Module
Conference MCMC-92
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AMD aims to stay in the race with Magny-Cours 12-core CPU
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based on Zen or Zen+ is not MCM and consist of one chip)
462:, and onboard VRAM (integrated into the GPU) on one MCM.
967:"MCP (Multichip Package) | Samsung Semiconductor"
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60:. Unsourced material may be challenged and removed.
217:The ICs are deposited on the base substrate using
525:, Ryzen Threadripper and Epyc CPUs based on the
796:Intel Moving to Chiplets: 'Client 2.0' for 7nm
348:Dempsey, Clovertown, Harpertown and Tigerton,
1130:
828:Memory vendors pile on '3D' stacking standard
324:mainframe's thermal conduction module (1980s)
225:The ICs that make up the MCM package may be:
8:
1003:"e-MMC based MCP | Samsung Memory Link"
511:architecture are MCMs of two or four chips (
136:A ceramic multi-chip module containing four
985:"NAND based MCP | Samsung Memory Link"
211:The substrate is built on ceramic, such as
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1123:
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327:Superconducting Multichip modules (1990s)
200:The substrate is a multi-layer laminated
120:Learn how and when to remove this message
131:
659:
352:(Kentsfield, Penryn-QC and Yorkfield),
735:Intel's View of the Chiplet Revolution
368:(those with the GT3e or GT4e graphics)
637:Chip packaging and package types list
7:
58:adding citations to reliable sources
830:.” April 2, 2013. February 5, 2016.
630:Advanced packaging (semiconductors)
471:Flash and RAM memory combined on a
204:(PCB), such as those used in AMD's
180:) is a multi-chip module that uses
943:"VIA's QuadCore: Nano Gets Bigger"
761:"2.5D - Semiconductor Engineering"
25:
826:Richard Chirgwin, The Register. “
733:Samuel K. Moore, IEEE Spectrum "
213:low temperature co-fired ceramic
160:(ICs or "chips"), semiconductor
34:
1110:– CDS Master MCM Designer Suite
484:MCP solutions combining mobile
307:Examples of multi-chip packages
260:) or is made of silicon (as in
45:needs additional citations for
1:
931:.” Retrieved August 4, 2015.
808:Jon Worrel (15 April 2012).
794:Dr. Ian Cutress, AnandTech "
669:"SoC vs. MCM vs SiP vs. SoP"
927:Satoru Iwata, Iwata Asks. “
286:personal digital assistants
174:Flip Chip Multi-Chip Module
1369:
1045:Lilly, Paul (2019-12-17).
750:" Retrieved 26 April, 2021
737:" Retrieved 26 April, 2021
667:Tummala, Rao (July 2006).
595:
288:(PDAs). With the use of a
698:Chiplets: A Short History
625:Hybrid integrated circuit
570:Any other processor with
456:Espresso (microprocessor)
167:hybrid integrated circuit
1301:Digital signal processor
1178:Graphics processing unit
862:10.1109/MCMC.1992.201478
700:Retrieved 26 April, 2021
539:MI series GPUs based on
895:Applied Physics Letters
696:Don Scansen, EE Times "
1108:MCM Design in AutoCAD
673:Solid State Technology
647:UFS Multi Chip Package
558:Intel Xe Ponte Vecchio
280:
141:
1317:List of SoC suppliers
929:Changes in Television
763:. Semiengineering.com
598:3D integrated circuit
592:3D multi-chip modules
572:High Bandwidth Memory
548:Radeon RX 7000 series
294:High Bandwidth Memory
290:3D integrated circuit
278:3D integrated circuit
275:
262:High Bandwidth Memory
202:printed circuit board
194:printed circuit board
135:
1262:Package on a package
856:. pp. 175–178.
338:Pentium II OverDrive
54:improve this article
1256:System in a package
941:Shimpi, Anand Lal.
907:1993ApPhL..62.1435B
587:with CPU and memory
580:with CPU and memory
158:integrated circuits
69:"Multi-chip module"
1221:Multiprocessor SoC
746:Semi Engineering "
641:Single Chip Module
602:Package on package
497:Ryzen Threadripper
364:, and models with
281:
248:-based processors.
142:
1335:
1334:
1250:Multi-chip module
1215:Network on a chip
1076:www.anandtech.com
1026:www.anandtech.com
947:www.anandtech.com
901:(12): 1435–1437.
613:System in package
156:) where multiple
146:multi-chip module
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18:Multi-Chip Module
16:(Redirected from
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1307:Embedded systems
1227:Programmable SoC
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405:ATI Technologies
301:Networks on Chip
276:Wireless NoC on
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71: –
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65:Find sources:
59:
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43:This article
41:
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32:
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1249:
1243:Alternatives
1079:. Retrieved
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1054:. Retrieved
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765:. Retrieved
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718:. Retrieved
715:FlippingBook
714:
705:
692:
681:. Retrieved
677:the original
672:
662:
635:Chip carrier
537:AMD Instinct
403:designed by
318:MCMs (1970s)
298:
282:
257:
251:
233:and Intel's
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173:
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107:
97:
90:
83:
76:
64:
52:Please help
47:verification
44:
1171:controllers
1051:HotHardware
1007:samsung.com
989:samsung.com
565:Meteor Lake
451:Nintendo's
366:Crystalwell
362:Kaby Lake-G
350:Core 2 Quad
334:Pentium Pro
235:Core 2 Quad
221:technology.
208:processors.
1353:Modularity
1342:Categories
1284:chronology
1154:Components
1081:2020-04-10
1056:2020-04-10
1031:2020-04-10
952:2020-04-10
767:2022-05-13
720:2023-12-05
683:2015-08-04
654:References
585:Lunar Lake
518:AMD's non-
254:interposer
80:newspapers
1279:Processor
880:109329843
358:Arrandale
354:Clarkdale
344:Presler,
342:Pentium D
303:(WiNoC).
219:Thin Film
182:flip chip
110:June 2013
814:Fudzilla
748:Chiplets
607:See also
578:M series
492:storage.
468:QuadCore
466:VIA Nano
447:IBM z196
409:Xbox 360
407:for the
372:SD cards
322:IBM 3081
242:chiplets
188:Overview
1272:Related
1223:(MPSoC)
903:Bibcode
482:Samsung
438:Power10
411:, with
258:organic
94:scholar
1289:design
1229:(PSoC)
878:
868:
649:(uMCP)
583:Intel
576:Apple
563:Intel
552:RDNA 3
541:CDNA 2
477:Micron
436:, and
434:POWER8
430:POWER7
426:POWER5
422:POWER4
418:POWER2
231:POWER5
154:"pins"
138:POWER5
96:
89:
82:
75:
67:
1303:(DSP)
1264:(PoP)
1258:(SiP)
1252:(MCM)
1235:(MCU)
1217:(NoC)
1208:Types
1180:(GPU)
1166:cores
1148:(SoC)
876:S2CID
643:(SCM)
621:(SoC)
615:(SIP)
531:Zen 3
527:Zen 2
523:Ryzen
513:Ryzen
453:Wii U
440:from
413:eDRAM
397:Xenos
331:Intel
246:Zen 2
206:Zen 2
178:FCMCM
101:JSTOR
87:books
1312:FPGA
1296:CPLD
1199:ASIC
866:ISBN
600:and
567:CPUs
560:GPUs
546:AMD
509:Zen+
501:Epyc
499:and
495:AMD
490:NAND
488:and
486:DRAM
399:, a
392:eUFS
390:and
388:eMMC
380:Sony
378:and
346:Xeon
162:dies
73:news
911:doi
858:doi
529:or
520:APU
507:or
505:Zen
475:by
473:PoP
460:GPU
442:IBM
401:GPU
313:IBM
252:An
150:MCM
56:by
1344::
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909:.
899:62
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428:,
424:,
420:,
374:,
360:,
356:,
340:,
336:,
296:.
172:A
144:A
1138:e
1131:t
1124:v
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91:·
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50:.
20:)
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