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Pertains to the packages that are used to provide larger, more robust assemblies for
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The following 38 pages are in this category, out of 38 total.
8:
75:List of integrated circuit packaging types
48:This list may not reflect recent changes
7:
167:Embedded wafer level ball grid array
390:Printed circuit board manufacturing
52:
40:
14:
337:Universal integrated circuit card
43:Pages in category "Chip carriers"
291:Small outline integrated circuit
33:chips that are then soldered to
1:
70:Fan-out wafer-level packaging
201:Integrated circuit packaging
406:
320:Thin small outline package
245:Multi-leaded power package
16:The main article for this
15:
301:Surface-mount technology
361:Zig-zag in-line package
325:Through-hole technology
380:Semiconductor packages
296:Solid Logic Technology
184:Flatpack (electronics)
179:Flat no-leads package
80:Wafer-level packaging
279:Quad in-line package
257:Package on a package
162:Electronic packaging
135:Dual in-line package
385:Integrated circuits
314:Thin Quad Flat Pack
223:Low insertion force
65:Chip-scale package
31:integrated circuit
274:Quad flat package
240:Multi-chip module
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213:Land grid array
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123:Copper–tungsten
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104:Ball grid array
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262:Pin grid array
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235:Mini-Cartridge
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35:circuit boards
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60:Chip carrier
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23:Chip carrier
21:
140:Dye-and-pry
374:Categories
218:Lead frame
157:E-Material
189:Flip chip
145:Dymalloy
18:category
117:Cerquad
92:AlSiC
349:XSON
20:is
376::
50:.
37:.
356:Z
344:X
332:U
308:T
286:S
269:Q
252:P
230:M
208:L
196:I
174:F
152:E
130:D
111:C
99:B
87:A
26:.
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