78:
components, although in some cases it can be done with other components or samples. The component of interest is submerged in a dye material, such as red steel dye, and placed under vacuum. This allows the dye to flow underneath the component and into any cracks or defects. The dye is then dried in
114:. This makes it useful technique to incorporate into a reliability test plan as part of the post test failure inspection. It is also a useful method to inspect or diagnose failures due to manufacturing defects or design flaws. This includes defects such as
95:, as it can inspect a full ball grid array which may consist of hundreds of solder joints. Cross sectioning, on the other hand, may only be able to inspect a single row of solder joints and requires a better initial idea of the failure site.
83:(PCB) and inspected for the presence of dye. Any fracture surface or interface will have dye present, indicating the presence of cracks or open circuits. IPC-TM-650 Method 2.4.53 specifies a process for dye-n-pry.
91:
Dye-n-Pry is a useful failure analysis technique to detect cracking or open circuits in BGA solder joints. This has some practical advantages over other destructive techniques, such as
79:
an oven (preferably overnight) to prevent smearing during separation, which could lead to false results. The part of interest is mechanically separated from the
288:
202:
337:
119:
115:
260:
367:
131:
232:
372:
357:
377:
342:
347:
327:
92:
332:
352:
362:
166:
55:
43:
122:
surface finishes or early failures due to excessive board flexure from depaneling or In-circuit test (ICT).
322:
80:
210:
111:
39:
71:
103:
47:
136:
75:
146:
316:
167:"IPC-TM-650 Method 2.4.53. Dye and Pull Test Method (Formerly Known as Dye and Pull)"
107:
99:
98:
Dye-n-pry can be useful for detecting several different failure modes. This includes
233:"Effective Reliability Test Plan Development using Physics of Failure"
141:
51:
177:
70:
penetrant material is used to inspect for interconnect failures in
289:"Best Practices in Avoiding Pad Cratering and Capacitor Cracking"
67:
203:"Solder joint failure analysis - Solid State Technology"
74:. This is mostly commonly done on solder joints for
8:
66:Dye-n-Pry is a useful technique in which a
16:Analysis of electronic circuit connections
54:joint integrity. It is an application of
261:"Optimizing the Board Assembly Process"
158:
87:Use in failure analysis of electronics
7:
14:
132:Failure of electronic components
102:or solder joint fracture from
44:surface mount technology (SMT)
1:
46:components to either perform
394:
240:Resources.dfrsolutions.com
338:Electronics manufacturing
72:integrated circuits (IC)
56:dye penetrant inspection
368:Reliability engineering
373:Semiconductor analysis
358:Nondestructive testing
378:Semiconductor devices
104:mechanical drop/shock
81:printed circuit board
76:ball grid array (BGA)
343:Engineering failures
40:destructive analysis
348:Integrated circuits
328:Digital electronics
213:on 21 November 2017
183:on 1 December 2017
42:technique used on
333:Electronic design
385:
353:Mechanical tests
307:
306:
304:
302:
296:Dfrsolutions.com
293:
285:
279:
278:
276:
274:
265:
257:
251:
250:
248:
246:
237:
229:
223:
222:
220:
218:
209:. Archived from
199:
193:
192:
190:
188:
182:
176:. Archived from
171:
163:
93:cross sectioning
48:failure analysis
393:
392:
388:
387:
386:
384:
383:
382:
363:Product testing
313:
312:
311:
310:
300:
298:
291:
287:
286:
282:
272:
270:
263:
259:
258:
254:
244:
242:
235:
231:
230:
226:
216:
214:
201:
200:
196:
186:
184:
180:
169:
165:
164:
160:
155:
137:Ball grid array
128:
112:thermal cycling
89:
64:
50:or inspect for
17:
12:
11:
5:
391:
389:
381:
380:
375:
370:
365:
360:
355:
350:
345:
340:
335:
330:
325:
315:
314:
309:
308:
280:
252:
224:
194:
157:
156:
154:
151:
150:
149:
147:Solder Fatigue
144:
139:
134:
127:
124:
118:for PCBs with
88:
85:
63:
60:
22:, also called
15:
13:
10:
9:
6:
4:
3:
2:
390:
379:
376:
374:
371:
369:
366:
364:
361:
359:
356:
354:
351:
349:
346:
344:
341:
339:
336:
334:
331:
329:
326:
324:
323:Chip carriers
321:
320:
318:
297:
290:
284:
281:
269:
262:
256:
253:
241:
234:
228:
225:
212:
208:
207:Electroiq.com
204:
198:
195:
179:
175:
168:
162:
159:
152:
148:
145:
143:
140:
138:
135:
133:
130:
129:
125:
123:
121:
117:
113:
109:
108:thermal shock
105:
101:
100:pad cratering
96:
94:
86:
84:
82:
77:
73:
69:
61:
59:
57:
53:
49:
45:
41:
37:
36:Dye Penetrant
33:
29:
25:
21:
299:. Retrieved
295:
283:
271:. Retrieved
267:
255:
243:. Retrieved
239:
227:
215:. Retrieved
211:the original
206:
197:
185:. Retrieved
178:the original
173:
161:
97:
90:
65:
35:
32:Dye Staining
31:
28:Dye and Pull
27:
23:
19:
18:
301:22 November
273:22 November
245:22 November
217:22 November
187:22 November
24:Dye And Pry
317:Categories
153:References
116:black pad
20:Dye-n-Pry
268:Smta.org
126:See also
174:Ipc.org
38:, is a
142:Solder
62:Method
52:solder
292:(PDF)
264:(PDF)
236:(PDF)
181:(PDF)
170:(PDF)
110:, or
34:, or
303:2017
275:2017
247:2017
219:2017
189:2017
120:ENIG
68:dye
319::
294:.
266:.
238:.
205:.
172:.
106:,
58:.
30:,
26:,
305:.
277:.
249:.
221:.
191:.
Text is available under the Creative Commons Attribution-ShareAlike License. Additional terms may apply.