533:
525:
434:
330:
683:, an alloy which melts at around 140 °F (62 °C), lower than the boiling point of water. The metal is melted into the solder joints of the device, where it remains liquid even once cooled down to room temperature, and the chip can simply be lifted off the board. This has the advantage of not damaging the PCB or the IC, although the solder joints must be carefully cleaned of any remaining Field's metal to maintain solder joint strength after resoldering.
637:
580:(DIP), the pins are too short to pull out, and solder melted on one joint will solidify before another can be melted. A technique sometimes used is the use of a large soldering-iron tip designed to melt the solder on all pins at once; different tips are required for different packages. The component is removed while the solder is molten, most easily by a spring-loaded puller attached to it before heating.
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25:
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66:
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heat the component, with nearby components shielded from the heat if necessary, followed by removal with tweezers or a vacuum tool. Removal of multi-pin components with a soldering iron and solder removal tools is impractical, as the solder between the component and the pads remains in place, unlike solder which can be removed from a hole.
619:
The entire board may be preheated to a temperature that all components can withstand indefinitely. Then localised heat is applied to the component to remove, with less heating required than from cold. Most frequently, a hot air (or hot gas) gun, with a nozzle of appropriate size and shape, is used to
556:
Desoldering requires application of heat to the solder joint and removing the molten solder so that the joint may be separated. Desoldering may be required to replace a defective component, to alter an existing circuit, or to salvage components for re-use. Use of too high a temperature or heating for
375:
Terminology is not totally standardised. Anything with a base unit with provision to maintain a stable temperature, pump air in either direction, etc., is often called a "station" (preceded by rework, soldering, desoldering, hot air); one, or sometimes more, tools may be connected to a station, e.g.,
569:
A component with one or two connections to the PCB can usually be removed by heating one joint, pulling out an end of the component while the solder is molten (bending the other lead to do so), and repeating for the second joint. Solder filling the hole can be removed with a pump or with a pointed
401:
connections from a PCB. The desoldering head must be designed so that the extracted solder does not solidify so as to obstruct it, or enter the pump, and can be removed and discarded easily. It is not possible to remove a multi-pin part by melting solder on the pins sequentially, as one joint will
615:
Otherwise, surface-mount components must be removed by heating the entire component to a temperature sufficient to melt the solder used, but not high or prolonged enough to damage the component. For most purposes, a temperature not exceeding 260 °C (500 °F) for a time not exceeding 10
627:
Portasol
Professional which can be fitted with a narrow hot-air nozzle, set to a temperature not controlled but approximately correct, to an industrial rework station with many facilities including hot-gas blowing, vacuum part holding, soldering iron head, and nozzles and fitting specific to
599:
To remove and recover all components, both through-hole and surface-mount, from a board which itself is usually no longer needed, a flame or hot air gun can be used to rapidly heat all parts so they can be pulled off. Parts may be damaged, and toxic fumes emitted, if excessive temperature or
408:
Hot air pumps blow air hot enough to melt all the solder around a small surface mounted part, and can be used for soldering parts in place, and for desoldering followed by removal before the solder solidifies by a vacuum pump or with tweezers. Hot air has a tendency to
476:
which is pushed down and locks into place. When triggered by pressing a button, the piston springs up, creating suction that sucks the solder off the soldered connection. The bulb type creates suction by squeezing and releasing a rubber bulb.
676:. This system prevents damage to the pads on the PCB, the IC, avoids overheating surrounding components and blowing them off and also reduces the risk of operator error when using tweezers or other tools that can damage the PCB or IC.
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connecting the layers, as this will ruin the entire board. Hard pulling on a lead which is not entirely free of solder (or with solder not thoroughly molten in the case of a soldering iron tip heating all pins) may pull out a via.
583:
Otherwise all joints must be freed from solder before the component can be removed. Each joint must be heated and the solder removed from it while molten using a vacuum pump, manual desoldering pump, or desoldering braid.
655:
or a high-rpm craft tool, simply by cutting off the leads. The stubs are then easy to melt off and clean with a soldering iron. Obviously this technique entails the destruction of the IC. Another method is to use a
548:. The braid is removed while the solder is still molten, its used section cut off and discarded when cool. Short lengths of cut braid will prevent heat being carried away by the braid instead of heating the joint.
664:
and heat up a corner, and gently pry it off, working the torch down the leads. This method often leads to traces getting lifted off the PCB where a lead did not get heated enough to cause the solder to flow.
651:(IC); usually a square IC. Removal of these chips can be problematic as it is impossible to heat all of the leads at once with a standard soldering iron. It is possible to remove them with the use of a
576:
Components with more connections cannot be removed intact in the way described above unless the wire leads are long and flexible enough to be pulled out one by one. For a component such as a
672:. The extractor uses a spring system that gently pulls the IC upward when the liquid stage of solder has been reached. The IC is held by a vacuum nozzle similar to the ones used in
730:
376:
a rework station may accommodate a soldering iron and hot air head. A soldering iron with a hollow tip and a spring-, bulb-, or electrically-operated suction pump may be called a
405:
Suction pumps are also used with a suction head appropriate for each part to pick up and remove tiny surface mount devices once solder has melted, and to place parts.
668:
Several vendors offer systems that use heat shields to concentrate hot air where it needs to be, protecting nearby components and avoiding damage to the board or the
812:
402:
solidify as the next is melted; pumps and solder wick are among methods to remove solder from all joints, leaving the part free to be removed.
87:
74:
756:"Typical guidelines on SMT soldering, Welwyn: "Components with Pb-free finish may be reflowed with peak temperatures of 260°C (10 seconds).""
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Suction pumps are used to suck away molten solder, leaving previously joined terminals disconnected. They are primarily used to release
540:
The end of a length of braid is placed over the soldered connections of a component being removed. The connections are heated with a
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If a multi-pin component need not be salvaged, it is often possible to cut the pins, then remove the residual ends one by one.
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731:"Terminology: commercial equipment described as "hot air system" with "suction pen" (in this case a vacuum-style IC handler)"
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trace and the board substrate. Techniques are different for through-hole and surface-mounted components.
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Hot air (or gas) may be applied with tools ranging from some portable gas soldering irons such as the
362:
Various picks and tweezers for tasks such as pulling at, holding, removing, and scraping components.
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647:(QFP) chips have thin leads closely packed together protruding from the four sides of the
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can be removed by cutting their leads and desoldering the remnants with a soldering iron.
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The pump is applied to a heated solder connection, then operated to suck the solder away.
469:
382:. Terms such as "suction pen" may be used; the meaning is usually clear from the context.
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are used for several purposes in conjunction with a hand-held head connected by a tube.
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object made of a material which solder does not wet, such as stainless steel or wood.
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on double-sided or multi-layer boards, special care must be taken not to remove the
785:
Junkbots, Bugbots & Bots on Wheels: Building Simple Robots with BEAM Technology
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style. (An electrically-operated pump for this purpose would usually be called a
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417:, can be used instead of air, at increased cost of equipment and consumables.
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371:, used to repair printed circuit board assemblies that fail factory test.
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344:
449:, is a manually-operated device which is used to remove solder from a
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243:. Statements consisting only of original research should be removed.
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Solders can be removed using a vacuum plunger (on the right) and a
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Vacuum and pressure pumps with specialized heater tips and nozzles
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too long may damage components or destroy the bond between a
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until the solder melts and is wicked into the braid by
437:
A solder sucker partially dismantled showing the spring
337:
Desoldering tools and materials include the following:
232:
16:
Removal of solder and components from a circuit board
137:. Unsourced material may be challenged and removed.
787:p. 57-58. California:McGraw-Hill/ Osborne.
679:Another way to remove these devices is to use
8:
640:Desoldering an IC with a JBC hot air system
53:Learn how and when to remove these messages
709:(2nd ed.), For Dummies, p. 251,
703:McComb, Gordon; Shamieh, Cathleen (2009),
277:Learn how and when to remove this message
259:Learn how and when to remove this message
197:Learn how and when to remove this message
698:
696:
608:If they do not need to be re-used, some
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90:of all important aspects of the article.
692:
468:The plunger type has a cylinder with a
783:Hrynkiw, Dave/ Tilden, Mark W.(2002).
536:... and soaked with solder and residue
86:Please consider expanding the lead to
429:A typical spring-loaded solder sucker
413:metals; a non-oxidising gas, usually
7:
321:, repair, replacement, and salvage.
135:adding citations to reliable sources
813:Printed circuit board manufacturing
333:Desoldering with a desoldering gun.
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34:This article has multiple issues.
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628:particular component packages.
122:needs additional citations for
78:may be too short to adequately
42:or discuss these issues on the
88:provide an accessible overview
1:
521:, usually supplied on a roll.
507:, is finely braided 18 to 42
600:prolonged heating is used.
453:. There are two types: the
239:the claims made and adding
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445:, colloquially known as a
347:, also called hot air guns
674:pick & place machines
359:Heated soldering tweezers
610:surface-mount components
706:Electronics For Dummies
616:seconds is acceptable.
589:through-hole technology
528:Solder wick, before use
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390:Electrically operated
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313:and components from a
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492:Solder wick on a reel
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451:printed circuit board
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131:improve this article
578:Dual-Inline Package
649:integrated circuit
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632:Quad flat packages
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309:is the removal of
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224:possibly contains
716:978-0-470-28697-5
645:Quad Flat Package
514:wire coated with
497:Desoldering braid
484:Desoldering braid
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758:. Archived from
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733:. Archived from
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546:capillary action
501:desoldering wick
499:, also known as
443:desoldering pump
421:Desoldering pump
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379:desoldering iron
350:Desoldering pump
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356:Removal fluxes
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762:on 2013-02-09
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146:"Desoldering"
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142:Find sources:
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764:. Retrieved
760:the original
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739:. Retrieved
735:the original
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662:butane torch
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249:January 2023
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187:January 2023
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129:Please help
124:verification
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96:January 2023
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75:lead section
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37:
36:Please help
33:
653:razor blade
505:solder wick
463:vacuum pump
341:Solder wick
307:desoldering
303:electronics
802:Categories
766:2012-05-03
741:2012-05-01
687:References
660:or pencil
457:style and
233:improve it
157:newspapers
39:improve it
808:Soldering
552:Technique
345:Heat guns
237:verifying
80:summarize
45:talk page
658:heat gun
472:-loaded
415:nitrogen
455:plunger
411:oxidise
231:Please
171:scholar
791:
713:
625:Weller
512:copper
474:piston
470:spring
311:solder
173:
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516:rosin
392:pumps
386:Pumps
325:Tools
178:JSTOR
164:books
789:ISBN
711:ISBN
587:For
519:flux
459:bulb
317:for
150:news
670:QFP
593:via
509:AWG
503:or
465:.)
301:In
235:by
133:by
804::
695:^
441:A
305:,
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